128KX8 FLASH 12V PROM, 150ns, PQCC32, PLASTIC, LCC-32
Parameter Name | Attribute value |
Maker | STMicroelectronics |
Parts packaging code | QFJ |
package instruction | PLASTIC, LCC-32 |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 150 ns |
JESD-30 code | R-PQCC-J32 |
length | 13.995 mm |
memory density | 1048576 bit |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Programming voltage | 12 V |
Certification status | Not Qualified |
Maximum seat height | 3.56 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
type | NOR TYPE |
width | 11.455 mm |
M28V101BK | M28V101BP | M28F101BK | M28F101BN | M28V101BN | M28F101BP | |
---|---|---|---|---|---|---|
Description | 128KX8 FLASH 12V PROM, 150ns, PQCC32, PLASTIC, LCC-32 | 128KX8 FLASH 12V PROM, 150ns, PDIP32, PLASTIC, DIP-32 | 128KX8 FLASH 12V PROM, 60ns, PQCC32, PLASTIC, LCC-32 | 128KX8 FLASH 12V PROM, 60ns, PDSO32, 8 X 20 MM, TSOP-32 | 128KX8 FLASH 12V PROM, 150ns, PDSO32, 8 X 20 MM, TSOP-32 | 128KX8 FLASH 12V PROM, 60ns, PDIP32, PLASTIC, DIP-32 |
Parts packaging code | QFJ | DIP | QFJ | TSOP | TSOP | DIP |
package instruction | PLASTIC, LCC-32 | PLASTIC, DIP-32 | PLASTIC, LCC-32 | 8 X 20 MM, TSOP-32 | 8 X 20 MM, TSOP-32 | PLASTIC, DIP-32 |
Contacts | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 150 ns | 150 ns | 60 ns | 60 ns | 150 ns | 60 ns |
JESD-30 code | R-PQCC-J32 | R-PDIP-T32 | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 |
length | 13.995 mm | 41.91 mm | 13.995 mm | 18.4 mm | 18.4 mm | 41.91 mm |
memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
memory width | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 |
word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | DIP | QCCJ | TSOP1 | TSOP1 | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Programming voltage | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.56 mm | 5.08 mm | 3.56 mm | 1.2 mm | 1.2 mm | 5.08 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 5.5 V | 5.5 V | 3.6 V | 5.5 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 4.5 V | 4.5 V | 3 V | 4.5 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 5 V | 5 V | 3.3 V | 5 V |
surface mount | YES | NO | YES | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | J BEND | THROUGH-HOLE | J BEND | GULL WING | GULL WING | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 0.5 mm | 0.5 mm | 2.54 mm |
Terminal location | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL |
type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
width | 11.455 mm | 15.24 mm | 11.455 mm | 8 mm | 8 mm | 15.24 mm |
Maker | STMicroelectronics | - | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |