for molded-in solder type contacts. Contrasting let-
ter or number designations are used on insert faces.
A fluorinated silicone interfacial seal wafer is fea-
tured on the mating face of “crimp type pin” inserts.
This assures complete electrical isolation of pins
when connector halves are mated. In addition, a
main joint gasket is installed in the receptacle for
moisture sealing between connector halves. Both
features are also available for hermetic receptacles.
Wall
Mounting
Receptacle
Wall
Mounting
Receptacle
Box
Mounting
Receptacle
Line
Receptacle
Straight
Plug
Jam
Nut
Receptacle
Contacts
Maximum design flexibility is built into the JT/LJT
Series, with a minimum of 2 to a maximum of 128
circuits per connector in a wide variety of contact
arrangements. Contacts are available in sizes 8,
10, 12, 16, 20, 22, 22D and 22M with standard 50
micro inch minimum gold plating (100 micro inches
optional). All socket contacts are probe proof. Crimp
type rear removable contacts are featured in JT-R
and LJT-R connectors. Solder termination contacts
are also available, as well as PCB, wire wrap, ther-
mocouple, fiber optic, coaxial, triaxial and twinax
contact options.
Jam Nut
Receptacle
Straight
Plug
90° Plug
Solder
Mounting
Receptacle
Optional Features
High temperature capability of 392°F is available
only in JTS or LJTS crimp type connectors. High
temperature versions feature gold plated contacts,
high temperature shell plating, stainless steel cou-
pling nut spring, and epoxy inserts/fluorinated sili-
cone grommet combination. Standard temperature
capability for both solder and crimp is 302°F.
The JTN or LJTN type connectors are available for
N
2
O
4
resistance provided they are mated, and un-
grommeted rear faces are suitably protected.
For complete listing and definition of connector
types, shell styles and service classes, see How to
Order, page 53. For information on Fail-Safe Lan-
yard Release style plugs see pages 38-41.
Lanyard
Release
Plug
Solder
Mounting
Receptacle
2
JT/LJT
specifications
CONTACT RATING
Test Current
Contact
Size
22M
Solder &
Crimp
3
Hermetic
2
Maximum
Millivolt Drop
Crimp*
45
Maximum
Millivolt Drop
Solder*
20
Hermetic*
60
Contact
Size
22M
22D
22D
5
22
20
16
12
3
5
7.5
13
23
73
3
5
10
17
73
55
49
42
33
85
20
20
20
20
NA
85
60
85
85
NA
22
20
16
12
10 (Power)
Crimp Well Data
Well
Nominal
Diameter
Well Depth
.028 ±.001
.0345 ±.0010
.0365 ±.0010
.047 ±.001
.067 ±.001
.100 ±.002
.137 ±.002
.141
.141
.141
.209
.209
.209
.355
+.004
–.000
+.004
.044
–.004
+.000
.078
–.004
.116 +.004
–.002
.036
NA
.094
.125
.141
.141
NA
Solder Well Data
Well
Nominal
Diameter
Well Depth
.029
+.004
–.000
* 10 (Power)
When tested using silver plated wire.
33
NA
SERVICE RATING**
Service
Rating
M
N
I
II
Suggested Operating Voltage
(Sea Level)
AC (RMS)
DC
400
300
600
900
500
450
850
1250
Test Voltage
(Sea Level)
1300 VRMS
1000 VRMS
1800 VRMS
2300 VRMS
Test Voltage
50,000 ft
550 VRMS
400 VRMS
600 VRMS
800 VRMS
Test Voltage
70,000 ft
350 VRMS
260 VRMS
400 VRMS
500 VRMS
Test Voltage
110,000 ft
200 VRMS
200 VRMS
200 VRMS
200 VRMS
** Please note that the establishment of electrical safety factors is left entirely in the designer’s hands, since he is in the best position to know what peak voltage,
switching
surges, transients, etc. can be expected in a particular circuit.
J-Link not only supports the burning of the Flash on the MCU , but also can directly burn the SPI Flash through the SPI protocol. Because the SPI protocol is used , even if the MCU connected to the SP...
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#include "DSP28x_Project.h"// Device Headerfile and Examples Include File
// Prototype statements for functions found within this file.
void InitEPwm1Exam...