NAND02GAH0IZC5F datasheet, PDF

NAND02GAH0IZC5F: DescriptionMemory IC, CMOS, PBGA153; Categorystorage storage; File Size630KB，30 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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NAND02GAH0IZC5F Overview

Memory IC, CMOS, PBGA153

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Micron Technology
package instruction	FBGA, BGA153,14X14,20
Reach Compliance Code	unknown
JESD-30 code	S-PBGA-B153
memory density	2147483648 bit
Number of terminals	153
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA153,14X14,20
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
power supply	1.8/3.3,3.3 V
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM

	NAND02GAH0IZC5F	NAND02GAH0IZC5E
Description	Memory IC, CMOS, PBGA153	Memory IC, CMOS, PBGA153
Is it Rohs certified?	conform to	conform to
Maker	Micron Technology	Micron Technology
package instruction	FBGA, BGA153,14X14,20	FBGA, BGA153,14X14,20
Reach Compliance Code	unknown	unknown
JESD-30 code	S-PBGA-B153	S-PBGA-B153
memory density	2147483648 bit	2147483648 bit
Number of terminals	153	153
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA
Encapsulate equivalent code	BGA153,14X14,20	BGA153,14X14,20
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
power supply	1.8/3.3,3.3 V	1.8/3.3,3.3 V
Certification status	Not Qualified	Not Qualified
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	OTHER	OTHER
Terminal form	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM

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