NAND02GAH0IZC5E Related Products
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NAND02GAH0IZC5E |
NAND02GAH0IZC5F |
Description |
Memory IC, CMOS, PBGA153 |
Memory IC, CMOS, PBGA153 |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Micron Technology |
Micron Technology |
package instruction |
FBGA, BGA153,14X14,20 |
FBGA, BGA153,14X14,20 |
Reach Compliance Code |
unknown |
unknown |
JESD-30 code |
S-PBGA-B153 |
S-PBGA-B153 |
memory density |
2147483648 bit |
2147483648 bit |
Number of terminals |
153 |
153 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-25 °C |
-25 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
FBGA |
FBGA |
Encapsulate equivalent code |
BGA153,14X14,20 |
BGA153,14X14,20 |
Package shape |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
power supply |
1.8/3.3,3.3 V |
1.8/3.3,3.3 V |
Certification status |
Not Qualified |
Not Qualified |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
OTHER |
OTHER |
Terminal form |
BALL |
BALL |
Terminal pitch |
0.5 mm |
0.5 mm |
Terminal location |
BOTTOM |
BOTTOM |