Flash, 64MX8, 18ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, FBGA-63
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SK Hynix |
| Parts packaging code | BGA |
| package instruction | VFBGA, BGA63,10X12,32 |
| Contacts | 63 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.1.A |
| Maximum access time | 18 ns |
| command user interface | YES |
| Data polling | NO |
| JESD-30 code | R-PBGA-B63 |
| length | 11 mm |
| memory density | 536870912 bit |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of functions | 1 |
| Number of departments/size | 4K |
| Number of terminals | 63 |
| word count | 67108864 words |
| character code | 64000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64MX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA63,10X12,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| page size | 512 words |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3/3.3 V |
| Programming voltage | 3.3 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Maximum seat height | 1 mm |
| Department size | 16K |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| switch bit | NO |
| type | SLC NAND TYPE |
| width | 9 mm |
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