Serial Memory Products
Serial Memory Products
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Serial EEPROM
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Serial SRAM
www.microchip.com/memory
Serial Memory Products
A broad portfolio of high performance, best-in-class Serial Memory Products
to meet all your design requirements.
Microchip offers the broadest range of Serial EEPROM devices (from 128 bits to 1 Mbit) over the widest operating
voltage (1.7 to 5.5V) and temperature ranges (up to 150ºC). Innovative low-power designs and extensive testing
have ensured industry leading endurance and best-in-class quality at low costs.
SPI-compatible Serial SRAM devices are available in 64 and 256 Kbit options and up to 20 MHz. These low power
devices provide additional external serial RAM with high-speed performance and are available in standard 8-pin
packages.
Microchip Supports Your Designs Throughout The Product Life Cycle
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Serial Memory Products
Serial Memory Advantages
Serial Memory Products
Outstanding Quality
Innovative Products
Serial EEPROM
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SPI, I
2
C™, Microwire, UNI
/
O® Bus
Non-Volatile Memory
128 bits-1Mbit
1.7V-5.5V
Reliable Supply
Serial SRAM
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SPI Bus, 20 MHz
Volatile Memory
8, 32 Kbytes
1.5V-1.95V; 2.7V-3.6V
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1M Cycles E/W Endurance
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Fast Read/Write Times
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Low Power Consumption
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Infinite Endurance
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Zero Write Speeds
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Low Power
Key Features
Serial architecture – I
2
C, SPI, UNI
/
O, Microwire
Broad range of densities
Tiny 3, 5, 6 and 8-pin packages, die & wafer
Innovative, low power designs
Industry leading endurance
Wide temperature and voltage range
Fast read and write times
Flexible:
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Byte write capability
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Package options
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Custom programming options
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Application-specific serial memory
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Microchip owned fabs, In-house testing
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Automotive flow on all products
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Key Benefits
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Lower system costs – innovative products, tiny packages,
low power consumption, fewer I
/
O pins, small form factor
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Save I
/
O pins on the MCU – more compact designs, add
additional features
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Secure data with write-protect options
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Highest quality EEPROMs
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Zero PPM initiatives – Triple-test flow
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>
1M cycles E/W endurance
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Faster time to market
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Short lead times
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Complete tools support
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Robust designs – broad operating conditions
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Long product life cycles
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Global sales & engineering support
Serial EEPROM Bus Comparison
Parameter
Density Range
Speed
I/O Pins
Package Options
Security Options
Pricing
I
2
C
128b-1 Mbit
Up to 1 MHz
2: Clock, Data
PDIP, SOIC, SOIJ, TSSOP,
MSOP, 2x3 T-DFN, 6x5 DFN,
SOT-23, SC70, WLCSP
HW
Least Expensive
Microwire
1 Kb-16 Kb
Up to 3 MHz
4: Clock, CS, DI, DO
PDIP, SOIC, TSSOP,
MSOP, 2x3 T-DFN,
SOT-23
HW
UNI/O
1 Kb-16 Kbit
Up to 100 KHz
1: Clock/Data
PDIP, SOIC, TSSOP,
MSOP, 2x3 T-DFN,
SOT-23, TO92, WLCSP
SW
SPI
1Kb-1 Mbit
Up to 20 MHz
4: SCK, CS, DI, DO
PDIP, SOIC, SOIJ, TSSOP,
MSOP, 2x3 T-DFN,
6x5 DFN, SOT-23
HW, SW
Most Expensive
Serial Memory Products
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Serial EEPROM
Innovative designs combined with in-house fabrication and outstanding testing
methodology has helped create the industry’s highest quality Serial EEPROM.
Microchip offers a broad selection of standard and application specific Serial EEPROM devices that are available in
all the standard serial busses – I
2
C, SPI, Microwire and the new single I/O UNI
/
O® bus.
Serial EEPROMs
Standard
EEPROMs
Specialty/Application
Specific EEPROMs
I
2
C™
128b-1 Mb; 1.7V-5.5V
UNI/O
®
Bus
1 Kb-16 Kb; 1.8V-5.5V
MAC Address Chips
EUI-48™ & EUI-64™ Node Address
Microwire
1 Kb-16 Kb; 1.8V-5.5V
SPI
1 Kb-1 Mb; 1.8V-5.5V
Partial Array Write Protect
½, ¼
and Whole Array WP Options
DIMM-DDR2/3
Packages
Reversible S/W Write Protect; I
2
C
Extended Temperature
.
5-SC70
(LT)
2 x 2 mm
.
3-SOT
(TT)
3 x 2.5 mm
5 & 6-SOT
(OT)
3 x 3 mm
.
8-TDFN
(MC/MNY)
2 x 3 mm
.
8-MSOP
(MS)
3 x 5 mm
.
8-TSSOP
(ST)
3 x 6.5 mm
-55ºC to 150ºC
VESA Monitors
DDC1™/DDC2™ Interface
Very Low Voltage
8-SOIC (SN)
5 x 6 mm
8-DFN (MF)
5 x 6 mm
8-SOIC (SM)
5 x 8 mm
8-PDIP (P)
8 x 9.5 mm
Die/Wafer
WL-CSP
1.5V EEPROM
Robust Design
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ESD Protection
> 4000V Human Body Model (HBM)
> 400V Machine Model (MM)
> 1000V Charged Device Model
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Latch-up protection > 200 mA on all pins
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ESD Induced Latch-up > 100V (MM) on V
DD
; >400V on all I
/
O
> 1M cycles Endurance and > 200 years data retention
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Up to 150°C Operation (reads and writes)
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Power-On Reset (POR) and Brown-Out Reset (BOR)
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Effective protection against noisy automotive environments
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Eliminates false writes
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Schmitt Trigger input filters for noise reduction
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Complete traceability including die location on wafer
Quality
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Microchip delivers highest quality
EEPROMs in the world
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World-class line yields (over 99%)
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ISO/TS16949-compliant
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Industry leader with triple test flow –
every cell of every part is tested
three times
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Near zero PPM field bit fails
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Statistical process control and
continuous improvement procedures
in all facilities
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Robustness and reliability designed in
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Automotive grade/flow
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Serial Memory Products
Memory Package Matrix
Memory Packages – more memory in less space!
Serial EEPROM devices from Microchip are available in a wide variety of tiny, innovative packages to help minimize
your design – save board space and cost!
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WLCSP – die-sized package – smallest form factor EEPROM package in the world!
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SC70 – smallest 5-lead EEPROM package!
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5-SOT-23 available up to 64 Kbit; 8-TDFN up to 128 Kbit, 8-SOIC up to 1 Mbit (I
2
C)
Density
Max
Speed
SOIC
SN
5x6
SOT-23
OT/TT
3x3
TSSOP
TS
3x6.5
TDFN
MNY/MC
2x3
PDIP
P
8x9.5
MSOP
MS
3x5
SOIJ
SM
5x8
DFN
MF
5x6
SC70
LT
2x2
TO92
TO
Wafer
W/S/WF
Die
WLCSP
CS
Die
I
2
C™ Bus 1.7V-5.5V
128bit-2K
4K-32K
64K
128K
256K
512K
1 Mbit
400 KHz
400 KHz
1 MHz
1 MHz
1 MHz
1 MHz
1 MHz
X
X
X
X
X
X
X
5
5
5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
5
X
X
X
X
X
X
X
X
X
X
X
Microwire Bus 1.8V-5.5V
1K-16K
3 MHz
X
6
X
X
X
X
X
SPI Bus 1.8V-5.5V
1K-4K
8K-64K
128K, 256K
512K
1 Mbit
10 MHz
10 MHz
10 MHz
20 MHz
20 MHz
X
X
X
X
6
X
X
X
14
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
UNI/O
®
Single-Wire Bus 1.8V-5.5V
1K-16K
100 KHz
X
3
X
X
X
X
X
X
Package Sizes
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5-SC70
(LT)
2 x 2 mm
.
3-SOT
(TT)
3 x 2.5 mm
.
.
.
8-TDFN
(MC/MNY)
2 x 3 mm
.
8-MSOP
(MS)
3 x 5 mm
.
8-TSSOP
(ST)
3 x 6.5 mm
8-SOIC (SN)
5 x 6 mm
8-DFN (MF)
5 x 6 mm
8-SOIC (SM)
5 x 8 mm
8-PDIP (P)
8 x 9.5 mm
Die/Wafer
WL-CSP
5 & 6-SOT
(OT)
3 x 3 mm
WLCSP – World’s Smallest EEPROM Package
WLCSP from Microchip is bumped die with a redistribution layer to route
the bond pads to the bumps.
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True ‘die-sized’ packages
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Industry’s smallest package, form factor
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Lowest profile package
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Available in I
2
C, UNI/O buses
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Compatible with standard surface mount assembly lines
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Fit a large density into a small space
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Applications: mobile phones, security cameras, sensors, servers,
networking, RF, medical, portable electronics
Wafer Level
Chip Scale Packaging
Actual Size
Enlarged to Show
Detail
WLCSP 4 Kbit I
2
C
<1 x 1 mm
Serial Memory Products
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