EEPROM, 2KX8, 200ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Atmel (Microchip) |
Parts packaging code | DIP |
package instruction | 0.600 INCH, CERDIP-24 |
Contacts | 24 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 200 ns |
Other features | AUTOMATIC WRITE |
command user interface | NO |
Data polling | YES |
Durability | 10000 Write/Erase Cycles |
JESD-30 code | R-GDIP-T24 |
JESD-609 code | e0 |
length | 32.15 mm |
memory density | 16384 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 24 |
word count | 2048 words |
character code | 2000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.72 mm |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.045 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
width | 15.24 mm |
Maximum write cycle time (tWC) | 1 ms |
AT28C16-20DI | AT28C16-15DI | AT28C16-25LM/883 | AT28C16-15LM/883 | AT28C16-25DI | AT28C16-20LM/883 | |
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Description | EEPROM, 2KX8, 200ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24 | EEPROM, 2KX8, 150ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24 | EEPROM, 2KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | EEPROM, 2KX8, 150ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | EEPROM, 2KX8, 250ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24 | EEPROM, 2KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | DIP | DIP | QFJ | QFJ | DIP | QFJ |
package instruction | 0.600 INCH, CERDIP-24 | 0.600 INCH, CERDIP-24 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 | DIP, DIP24,.6 | QCCN, LCC32,.45X.55 |
Contacts | 24 | 24 | 32 | 32 | 24 | 32 |
Reach Compliance Code | unknown | unknown | compliant | unknown | compliant | unknown |
ECCN code | EAR99 | EAR99 | 3A001.A.2.C | 3A001.A.2.C | EAR99 | 3A001.A.2.C |
Maximum access time | 200 ns | 150 ns | 250 ns | 150 ns | 250 ns | 200 ns |
Other features | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE |
command user interface | NO | NO | NO | NO | NO | NO |
Data polling | YES | YES | YES | YES | YES | YES |
Durability | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
JESD-30 code | R-GDIP-T24 | R-GDIP-T24 | R-CQCC-N32 | R-CQCC-N32 | R-GDIP-T24 | R-CQCC-N32 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
length | 32.15 mm | 32.15 mm | 13.97 mm | 13.97 mm | 32.15 mm | 13.97 mm |
memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 32 | 32 | 24 | 32 |
word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C |
organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | QCCN | QCCN | DIP | QCCN |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | LCC32,.45X.55 | LCC32,.45X.55 | DIP24,.6 | LCC32,.45X.55 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Programming voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.72 mm | 5.72 mm | 2.54 mm | 2.54 mm | 5.72 mm | 2.54 mm |
Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
Maximum slew rate | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | YES | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD |
Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
switch bit | NO | NO | NO | NO | NO | NO |
width | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm | 15.24 mm | 11.43 mm |
Maximum write cycle time (tWC) | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms |
Base Number Matches | - | 1 | 1 | 1 | 1 | - |