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AT28C16-20DI

Description
EEPROM, 2KX8, 200ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24
Categorystorage    storage   
File Size57KB,2 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

AT28C16-20DI Overview

EEPROM, 2KX8, 200ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24

AT28C16-20DI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAtmel (Microchip)
Parts packaging codeDIP
package instruction0.600 INCH, CERDIP-24
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
Other featuresAUTOMATIC WRITE
command user interfaceNO
Data pollingYES
Durability10000 Write/Erase Cycles
JESD-30 codeR-GDIP-T24
JESD-609 codee0
length32.15 mm
memory density16384 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2KX8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height5.72 mm
Maximum standby current0.0001 A
Maximum slew rate0.045 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
width15.24 mm
Maximum write cycle time (tWC)1 ms

AT28C16-20DI Related Products

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Description EEPROM, 2KX8, 200ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24 EEPROM, 2KX8, 150ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24 EEPROM, 2KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 EEPROM, 2KX8, 150ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 EEPROM, 2KX8, 250ns, Parallel, CMOS, CDIP24, 0.600 INCH, CERDIP-24 EEPROM, 2KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP QFJ QFJ DIP QFJ
package instruction 0.600 INCH, CERDIP-24 0.600 INCH, CERDIP-24 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 DIP, DIP24,.6 QCCN, LCC32,.45X.55
Contacts 24 24 32 32 24 32
Reach Compliance Code unknown unknown compliant unknown compliant unknown
ECCN code EAR99 EAR99 3A001.A.2.C 3A001.A.2.C EAR99 3A001.A.2.C
Maximum access time 200 ns 150 ns 250 ns 150 ns 250 ns 200 ns
Other features AUTOMATIC WRITE AUTOMATIC WRITE AUTOMATIC WRITE AUTOMATIC WRITE AUTOMATIC WRITE AUTOMATIC WRITE
command user interface NO NO NO NO NO NO
Data polling YES YES YES YES YES YES
Durability 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles
JESD-30 code R-GDIP-T24 R-GDIP-T24 R-CQCC-N32 R-CQCC-N32 R-GDIP-T24 R-CQCC-N32
JESD-609 code e0 e0 e0 e0 e0 e0
length 32.15 mm 32.15 mm 13.97 mm 13.97 mm 32.15 mm 13.97 mm
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 24 24 32 32 24 32
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 125 °C 125 °C 85 °C 125 °C
Minimum operating temperature -40 °C -40 °C -55 °C -55 °C -40 °C -55 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP QCCN QCCN DIP QCCN
Encapsulate equivalent code DIP24,.6 DIP24,.6 LCC32,.45X.55 LCC32,.45X.55 DIP24,.6 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.72 mm 5.72 mm 2.54 mm 2.54 mm 5.72 mm 2.54 mm
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA 0.045 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL MILITARY MILITARY INDUSTRIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL QUAD QUAD DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit NO NO NO NO NO NO
width 15.24 mm 15.24 mm 11.43 mm 11.43 mm 15.24 mm 11.43 mm
Maximum write cycle time (tWC) 1 ms 1 ms 1 ms 1 ms 1 ms 1 ms
Base Number Matches - 1 1 1 1 -
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