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H23C64CP

Description
MASK ROM, 8KX8, 550ns, CMOS, PDIP24
Categorystorage    storage   
File Size95KB,4 Pages
ManufacturerHughes Aircraft
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H23C64CP Overview

MASK ROM, 8KX8, 550ns, CMOS, PDIP24

H23C64CP Parametric

Parameter NameAttribute value
MakerHughes Aircraft
package instruction,
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time550 ns
Other featuresSTATIC CMOS
JESD-30 codeR-PDIP-T24
memory density65536 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals24
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)6.5 V
Minimum supply voltage (Vsup)4 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal locationDUAL

H23C64CP Related Products

H23C64CP H23C64CY H23C64CD H23C64CH H23C64CL
Description MASK ROM, 8KX8, 550ns, CMOS, PDIP24 MASK ROM, 8KX8, 550ns, CMOS, CDIP24 MASK ROM, 8KX8, 550ns, CMOS, CDIP24 MASK ROM, 8KX8, 550ns, CMOS MASK ROM, 8KX8, 550ns, CMOS, CQCC24, LCC-24
Maker Hughes Aircraft Hughes Aircraft Hughes Aircraft Hughes Aircraft Hughes Aircraft
Reach Compliance Code unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 550 ns 550 ns 550 ns 550 ns 550 ns
Other features STATIC CMOS STATIC CMOS STATIC CMOS STATIC CMOS STATIC CMOS
JESD-30 code R-PDIP-T24 R-GDIP-T24 R-CDIP-T24 X-XUUC-N S-CQCC-N24
memory density 65536 bit 65536 bit 65536 bit 65536 bit 65536 bi
Memory IC Type MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
memory width 8 8 8 8 8
Number of functions 1 1 1 1 1
word count 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
organize 8KX8 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED SQUARE
Package form IN-LINE IN-LINE IN-LINE UNCASED CHIP CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 6.5 V 6.5 V 6.5 V 6.5 V 6.5 V
Minimum supply voltage (Vsup) 4 V 4 V 4 V 4 V 4 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO YES YES
technology CMOS CMOS CMOS CMOS CMOS
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD
Terminal location DUAL DUAL DUAL UPPER QUAD
Number of terminals 24 24 24 - 24
Maximum operating temperature 85 °C 125 °C 125 °C - 125 °C
Minimum operating temperature -40 °C -55 °C -55 °C - -55 °C
Temperature level INDUSTRIAL MILITARY MILITARY - MILITARY

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