|
HYB39S64800BTL-10 |
HYB39S64160BT-10 |
HYB39S64160BTL-10 |
HYB39S64400BT-10 |
HYB39S64400BTL-10 |
HYB39S64800BT-10 |
Description |
Synchronous DRAM, 8MX8, 7ns, CMOS, PDSO54, 10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
Synchronous DRAM, 4MX16, 7ns, CMOS, PDSO54, 10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
Synchronous DRAM, 4MX16, 7ns, CMOS, PDSO54, 10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
Synchronous DRAM, 16MX4, 7ns, CMOS, PDSO54, 10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
Synchronous DRAM, 16MX4, 7ns, CMOS, PDSO54, 10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
Synchronous DRAM, 8MX8, 7ns, CMOS, PDSO54, 10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
Infineon |
Infineon |
Infineon |
Infineon |
Infineon |
Infineon |
Parts packaging code |
TSOP2 |
TSOP2 |
TSOP2 |
TSOP2 |
TSOP2 |
TSOP2 |
package instruction |
10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
10.16 X 22.22 MM, 0.80 MM PITCH, PLASTIC, TSOP2-54 |
Contacts |
54 |
54 |
54 |
54 |
54 |
54 |
Reach Compliance Code |
not_compliant |
unknown |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
access mode |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
Maximum access time |
7 ns |
7 ns |
7 ns |
7 ns |
7 ns |
7 ns |
Maximum clock frequency (fCLK) |
100 MHz |
100 MHz |
100 MHz |
100 MHz |
100 MHz |
100 MHz |
I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
interleaved burst length |
1,2,4,8 |
1,2,4,8 |
1,2,4,8 |
1,2,4,8 |
1,2,4,8 |
1,2,4,8 |
JESD-30 code |
R-PDSO-G54 |
R-PDSO-G54 |
R-PDSO-G54 |
R-PDSO-G54 |
R-PDSO-G54 |
R-PDSO-G54 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
length |
22.22 mm |
22.22 mm |
22.22 mm |
22.22 mm |
22.22 mm |
22.22 mm |
memory density |
67108864 bit |
67108864 bit |
67108864 bit |
67108864 bit |
67108864 bit |
67108864 bit |
Memory IC Type |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
memory width |
8 |
16 |
16 |
4 |
4 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
54 |
54 |
54 |
54 |
54 |
54 |
word count |
8388608 words |
4194304 words |
4194304 words |
16777216 words |
16777216 words |
8388608 words |
character code |
8000000 |
4000000 |
4000000 |
16000000 |
16000000 |
8000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
organize |
8MX8 |
4MX16 |
4MX16 |
16MX4 |
16MX4 |
8MX8 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSOP2 |
TSOP2 |
TSOP2 |
TSOP2 |
TSOP2 |
TSOP2 |
Encapsulate equivalent code |
TSOP54,.46,32 |
TSOP54,.46,32 |
TSOP54,.46,32 |
TSOP54,.46,32 |
TSOP54,.46,32 |
TSOP54,.46,32 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
refresh cycle |
4096 |
4096 |
4096 |
4096 |
4096 |
4096 |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
Continuous burst length |
1,2,4,8,FP |
1,2,4,8,FP |
1,2,4,8,FP |
1,2,4,8,FP |
1,2,4,8,FP |
1,2,4,8,FP |
Maximum standby current |
0.001 A |
0.001 A |
0.001 A |
0.001 A |
0.001 A |
0.001 A |
Maximum slew rate |
0.09 mA |
0.09 mA |
0.09 mA |
0.09 mA |
0.09 mA |
0.09 mA |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
10.16 mm |
10.16 mm |
10.16 mm |
10.16 mm |
10.16 mm |
10.16 mm |