Fast Page DRAM, 512KX9, 80ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
Parts packaging code | SOJ |
package instruction | SOJ, SOJ28,.44 |
Contacts | 28 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 80 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
I/O type | COMMON |
JESD-30 code | R-PDSO-J28 |
JESD-609 code | e0 |
length | 18.42 mm |
memory density | 4718592 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 9 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 28 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX9 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Encapsulate equivalent code | SOJ28,.44 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum seat height | 3.76 mm |
self refresh | YES |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.095 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10.16 mm |
KM49C512LLJ-8 | KM49C512LLZ-7 | KM49C512LLT-7 | KM49C512LLJ-10 | KM49C512LLTR-8 | KM49C512LLT-8 | KM49C512LLTR-10 | KM49C512LLZ-8 | KM49C512LLZ-10 | KM49C512LLTR-7 | |
---|---|---|---|---|---|---|---|---|---|---|
Description | Fast Page DRAM, 512KX9, 80ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Fast Page DRAM, 512KX9, 70ns, CMOS, PZIP28, PLASTIC, ZIP-28 | Fast Page DRAM, 512KX9, 70ns, CMOS, PDSO28, PLASTIC, TSOP2-28 | Fast Page DRAM, 512KX9, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Fast Page DRAM, 512KX9, 80ns, CMOS, PDSO28, PLASTIC, REVERSE, TSOP2-28 | Fast Page DRAM, 512KX9, 80ns, CMOS, PDSO28, PLASTIC, TSOP2-28 | Fast Page DRAM, 512KX9, 100ns, CMOS, PDSO28, PLASTIC, REVERSE, TSOP2-28 | Fast Page DRAM, 512KX9, 80ns, CMOS, PZIP28, PLASTIC, ZIP-28 | Fast Page DRAM, 512KX9, 100ns, CMOS, PZIP28, PLASTIC, ZIP-28 | Fast Page DRAM, 512KX9, 70ns, CMOS, PDSO28, PLASTIC, REVERSE, TSOP2-28 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | SOJ | ZIP | TSOP | SOJ | TSOP | TSOP | TSOP | ZIP | ZIP | TSOP |
package instruction | SOJ, SOJ28,.44 | ZIP, ZIP28,.1 | TSOP2, TSOP28,.46 | SOJ, SOJ28,.44 | TSOP2-R, TSOP28,.46 | TSOP2, TSOP28,.46 | TSOP2-R, TSOP28,.46 | ZIP, ZIP28,.1 | ZIP, ZIP28,.1 | TSOP2-R, TSOP28,.46 |
Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
Maximum access time | 80 ns | 70 ns | 70 ns | 100 ns | 80 ns | 80 ns | 100 ns | 80 ns | 100 ns | 70 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDSO-J28 | R-PZIP-T28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PZIP-T28 | R-PZIP-T28 | R-PDSO-G28 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit |
Memory IC Type | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 | 512KX9 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOJ | ZIP | TSOP2 | SOJ | TSOP2-R | TSOP2 | TSOP2-R | ZIP | ZIP | TSOP2-R |
Encapsulate equivalent code | SOJ28,.44 | ZIP28,.1 | TSOP28,.46 | SOJ28,.44 | TSOP28,.46 | TSOP28,.46 | TSOP28,.46 | ZIP28,.1 | ZIP28,.1 | TSOP28,.46 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
Maximum seat height | 3.76 mm | 10.16 mm | 1.2 mm | 3.76 mm | 1.2 mm | 1.2 mm | 1.2 mm | 10.16 mm | 10.16 mm | 1.2 mm |
self refresh | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
Maximum slew rate | 0.095 mA | 0.11 mA | 0.11 mA | 0.08 mA | 0.095 mA | 0.095 mA | 0.08 mA | 0.095 mA | 0.08 mA | 0.11 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | YES | YES | YES | YES | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | THROUGH-HOLE | GULL WING | J BEND | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG | ZIG-ZAG | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 10.16 mm | 2.96 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 2.96 mm | 2.96 mm | 10.16 mm |
Maker | SAMSUNG | - | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
length | 18.42 mm | - | 18.41 mm | 18.42 mm | 18.41 mm | 18.41 mm | 18.41 mm | - | - | 18.41 mm |