L7C185CC12 datasheet, PDF - EEWORLD Datasheet

L7C185CC12: DescriptionStandard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28; Categorystorage storage; File Size819KB，7 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L7C185CC12 Overview

Standard SRAM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	DIP, DIP28,.3
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	12 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	36.83 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.00015 A
Minimum standby current	2 V
Maximum slew rate	0.195 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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