RISC Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | DIP |
package instruction | SIDE BRAZED, CERAMIC, DIP-40 |
Contacts | 40 |
Reach Compliance Code | unknown |
bit size | 8 |
JESD-30 code | R-XDIP-T40 |
JESD-609 code | e0 |
Number of terminals | 40 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
speed | 6 MHz |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
CA80C85B-6ED | CA80C85B-6CD | CA80C85B-5CD | CA80C85B-5ID | CA80C85B-6ID | CA80C85B-5ED | |
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Description | RISC Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40 | RISC Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40 | Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40 | Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40 | Microprocessor, 8-Bit, 6MHz, CMOS, CDIP40, SIDE BRAZED, CERAMIC, DIP-40 | RISC Microprocessor, 8-Bit, 5MHz, CMOS, CDIP40 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP |
package instruction | SIDE BRAZED, CERAMIC, DIP-40 | SIDE BRAZED, CERAMIC, DIP-40 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | SIDE BRAZED, CERAMIC, DIP-40 |
Contacts | 40 | 40 | 40 | 40 | 40 | 40 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
bit size | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 code | R-XDIP-T40 | R-XDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-XDIP-T40 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 |
Maximum operating temperature | 125 °C | 70 °C | 70 °C | 85 °C | 85 °C | 125 °C |
Minimum operating temperature | -55 °C | - | - | -40 °C | -40 °C | -55 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
speed | 6 MHz | 6 MHz | 5 MHz | 5 MHz | 6 MHz | 5 MHz |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR, RISC |
Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Maximum slew rate | - | - | 21 mA | 29 mA | 29 mA | 32 mA |