FIFO, 256X9, 10ns, Synchronous, CMOS, PQCC32, GREEN, PLASTIC, LCC-32
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | QFJ |
package instruction | QCCJ, LDCC32,.5X.6 |
Contacts | 32 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 10 ns |
Maximum clock frequency (fCLK) | 66.7 MHz |
period time | 15 ns |
JESD-30 code | R-PQCC-J32 |
JESD-609 code | e3 |
length | 13.9954 mm |
memory density | 2304 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 256 words |
character code | 256 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256X9 |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 3.556 mm |
Maximum standby current | 0.005 A |
Maximum slew rate | 0.02 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Matte Tin (Sn) - annealed |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 11.4554 mm |