Flash, 8MX16, 65ns, PBGA80, 8 X 11 MM, FBGA-80
Parameter Name | Attribute value |
Maker | SPANSION |
Parts packaging code | BGA |
package instruction | 8 X 11 MM, FBGA-80 |
Contacts | 80 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.1.A |
Maximum access time | 65 ns |
startup block | BOTTOM/TOP |
JESD-30 code | R-PBGA-B80 |
JESD-609 code | e1 |
length | 11 mm |
memory density | 134217728 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 80 |
word count | 8388608 words |
character code | 8000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 8MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 1 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
type | NOR TYPE |
width | 8 mm |