IBM25PPC750L-EB0A300W datasheet, PDF

IBM25PPC750L-EB0A300W: DescriptionRISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360; CategoryThe embedded processor and controller Microcontrollers and processors; File Size610KB，46 Pages; ManufacturerIBM; Websitehttp://www.ibm.com

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IBM25PPC750L-EB0A300W Overview

RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	IBM
Parts packaging code	BGA
package instruction	BGA, BGA360,19X19,50
Contacts	360
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CBGA-B360
JESD-609 code	e0
length	25 mm
low power mode	YES
Number of terminals	360
Maximum operating temperature	65 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Encapsulate equivalent code	BGA360,19X19,50
Package shape	SQUARE
Package form	GRID ARRAY
power supply	2.05,3.3 V
Certification status	Not Qualified
Maximum seat height	3.2 mm
speed	300 MHz
Maximum supply voltage	2.1 V
Minimum supply voltage	2 V
Nominal supply voltage	2.05 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	25 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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