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HB56UW464EJN-6B

Description
EDO DRAM Module, 4MX64, 60ns, MOS
Categorystorage    storage   
File Size308KB,27 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric Compare View All

HB56UW464EJN-6B Overview

EDO DRAM Module, 4MX64, 60ns, MOS

HB56UW464EJN-6B Parametric

Parameter NameAttribute value
MakerHitachi (Renesas )
package instructionDIMM, DIMM168
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE WITH EDO
Maximum access time60 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density268435456 bit
Memory IC TypeEDO DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals168
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
self refreshNO
Maximum standby current0.016 A
Maximum slew rate1.6 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
HB56UW464EJN-6B/7B
4,194,304-word
×
64-bit High Density Dynamic RAM Module
168-pin JEDEC Standard Outline Unbufferd 8 byte DIMM
ADE-203-594(Z)
Preliminary- Rev. 0.0
May. 15, 1996
Description
The HB56UW464EJN belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been
developed as an optimized main memory solution for 4 and 8 Byte processor applications.
The HB56UW464EJN is a 4M
×
64 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM
(HM51W16405BJ) sealed in SOJ package and 1 piece of serial EEPROM (24C02) for Presence Detect
(PD). The HB56UW464EJN offers Extended Data Out (EDO) Page Mode as a high speed access mode.
An outline of the HB56UW464EJN is 168-pin socket type package (dual lead out). Therefore, the
HB56UW464EJN makes high density mounting possible without surface mount technology. The
HB56UW464EJN provides common data inputs and outputs. Decoupling capacitors are mounted beneath
each SOJ on the module board.
Features
168-pin socket type package (Dual lead out)
Lead pitch: 1.27 mm
Single 3.3V (±10%) supply
High speed
Access time: t
RAC
= 60/70 ns (max)
Access time: t
CAC
= 15/18 ns (max)
Low power dissipation
Active mode: 4.6/4.1 W (max)
Standby mode (TTL): 116 mW (max)
Standby mode (CMOS): 58 mW (max)
EDO page mode capability
4,096 refresh cycle: 64 ms
3 variations of refresh
RAS-only
refresh
CAS-before-RAS
refresh
Hidden refresh

HB56UW464EJN-6B Related Products

HB56UW464EJN-6B HB56UW464EJN-7B
Description EDO DRAM Module, 4MX64, 60ns, MOS EDO DRAM Module, 4MX64, 70ns, MOS
Maker Hitachi (Renesas ) Hitachi (Renesas )
package instruction DIMM, DIMM168 DIMM, DIMM168
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode FAST PAGE WITH EDO FAST PAGE WITH EDO
Maximum access time 60 ns 70 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168
memory density 268435456 bit 268435456 bit
Memory IC Type EDO DRAM MODULE EDO DRAM MODULE
memory width 64 64
Number of functions 1 1
Number of ports 1 1
Number of terminals 168 168
word count 4194304 words 4194304 words
character code 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 4MX64 4MX64
Output characteristics 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
refresh cycle 4096 4096
self refresh NO NO
Maximum standby current 0.016 A 0.016 A
Maximum slew rate 1.6 mA 1.44 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount NO NO
technology MOS MOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm
Terminal location DUAL DUAL
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