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MR0A08BCSO35

Description
Memory Circuit, 128KX8, CMOS, PDSO32, ROHS COMPLIANT, MO-119, SOIC-32
Categorystorage    storage   
File Size1MB,23 Pages
ManufacturerEverspin Technologies
Environmental Compliance
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MR0A08BCSO35 Overview

Memory Circuit, 128KX8, CMOS, PDSO32, ROHS COMPLIANT, MO-119, SOIC-32

MR0A08BCSO35 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerEverspin Technologies
Parts packaging codeSOIC
package instructionSOP, SOP32,.4
Contacts32
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time35 ns
JESD-30 codeR-PDSO-G32
length20.726 mm
memory density1048576 bit
Memory IC TypeMEMORY CIRCUIT
memory width8
Mixed memory typesN/A
Humidity sensitivity level3
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP32,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height2.286 mm
Maximum standby current0.007 A
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.25 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.505 mm

MR0A08BCSO35 Related Products

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Description Memory Circuit, 128KX8, CMOS, PDSO32, ROHS COMPLIANT, MO-119, SOIC-32 Memory Circuit, 128KX8, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48 Memory Circuit, 128KX8, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48 Memory Circuit, 128KX8, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 128KX8, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 Memory Circuit, 128KX8, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48 Memory Circuit, 128KX8, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Maker Everspin Technologies Everspin Technologies Everspin Technologies Everspin Technologies Everspin Technologies Everspin Technologies Everspin Technologies
Parts packaging code SOIC BGA BGA TSOP2 TSOP2 BGA BGA
package instruction SOP, SOP32,.4 LFBGA, BGA48,6X8,30 LFBGA, BGA48,6X8,30 TSOP2, TSOP44,.46,32 TSOP2, TSOP44,.46,32 LFBGA, BGA48,6X8,30 LFBGA, BGA48,6X8,30
Contacts 32 48 48 44 44 48 48
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 35 ns 35 ns 35 ns 35 ns 35 ns 35 ns 35 ns
JESD-30 code R-PDSO-G32 S-PBGA-B48 S-PBGA-B48 R-PDSO-G44 R-PDSO-G44 S-PBGA-B48 S-PBGA-B48
length 20.726 mm 8 mm 8 mm 18.41 mm 18.41 mm 8 mm 8 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 8 8 8 8 8 8 8
Mixed memory types N/A N/A N/A N/A N/A N/A N/A
Humidity sensitivity level 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1
Number of terminals 32 48 48 44 44 48 48
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP LFBGA LFBGA TSOP2 TSOP2 LFBGA LFBGA
Encapsulate equivalent code SOP32,.4 BGA48,6X8,30 BGA48,6X8,30 TSOP44,.46,32 TSOP44,.46,32 BGA48,6X8,30 BGA48,6X8,30
Package shape RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form SMALL OUTLINE GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.286 mm 1.35 mm 1.35 mm 1.2 mm 1.2 mm 1.35 mm 1.35 mm
Maximum standby current 0.007 A 0.007 A 0.007 A 0.007 A 0.007 A 0.007 A 0.007 A
Maximum slew rate 0.07 mA 0.07 mA 0.065 mA 0.065 mA 0.065 mA 0.07 mA 0.065 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal form GULL WING BALL BALL GULL WING GULL WING BALL BALL
Terminal pitch 1.25 mm 0.75 mm 0.75 mm 0.8 mm 0.8 mm 0.75 mm 0.75 mm
Terminal location DUAL BOTTOM BOTTOM DUAL DUAL BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 40 40 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.505 mm 8 mm 8 mm 10.16 mm 10.16 mm 8 mm 8 mm

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