MR0A08BMA35 datasheet, PDF - EEWORLD Datasheet

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MR0A08BMA35: DescriptionMemory Circuit, 128KX8, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48; Categorystorage storage; File Size1MB，23 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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MR0A08BMA35 Overview

Memory Circuit, 128KX8, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48

MR0A08BMA35 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
Parts packaging code	BGA
package instruction	LFBGA, BGA48,6X8,30
Contacts	48
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	35 ns
JESD-30 code	S-PBGA-B48
length	8 mm
memory density	1048576 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Mixed memory types	N/A
Humidity sensitivity level	3
Number of functions	1
Number of terminals	48
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.35 mm
Maximum standby current	0.007 A
Maximum slew rate	0.065 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies	Everspin Technologies
Parts packaging code	BGA	BGA	BGA	TSOP2	TSOP2	BGA	SOIC
package instruction	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	LFBGA, BGA48,6X8,30	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	LFBGA, BGA48,6X8,30	SOP, SOP32,.4
Contacts	48	48	48	44	44	48	32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	35 ns	35 ns	35 ns	35 ns	35 ns	35 ns	35 ns
JESD-30 code	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	R-PDSO-G44	R-PDSO-G44	S-PBGA-B48	R-PDSO-G32
length	8 mm	8 mm	8 mm	18.41 mm	18.41 mm	8 mm	20.726 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8	8	8	8	8	8
Mixed memory types	N/A	N/A	N/A	N/A	N/A	N/A	N/A
Humidity sensitivity level	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1
Number of terminals	48	48	48	44	44	48	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	TSOP2	TSOP2	LFBGA	SOP
Encapsulate equivalent code	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	TSOP44,.46,32	TSOP44,.46,32	BGA48,6X8,30	SOP32,.4
Package shape	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.35 mm	1.35 mm	1.35 mm	1.2 mm	1.2 mm	1.35 mm	2.286 mm
Maximum standby current	0.007 A	0.007 A	0.007 A	0.007 A	0.007 A	0.007 A	0.007 A
Maximum slew rate	0.065 mA	0.07 mA	0.065 mA	0.065 mA	0.065 mA	0.07 mA	0.07 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	GULL WING	GULL WING	BALL	GULL WING
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.8 mm	0.8 mm	0.75 mm	1.25 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	DUAL	DUAL	BOTTOM	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	40	40	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8 mm	8 mm	8 mm	10.16 mm	10.16 mm	8 mm	7.505 mm

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