64-BIT, 75.19MHz, OTHER DSP, PBGA532, 23 X 23 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-532
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Texas Instruments |
Parts packaging code | BGA |
package instruction | FBGA, BGA532,26X26,32 |
Contacts | 532 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.3 |
Other features | ALSO REQUIRES 3.3V SUPPLY |
Address bus width | 23 |
barrel shifter | NO |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 75.19 MHz |
External data bus width | 64 |
Format | FIXED POINT |
Internal bus architecture | MULTIPLE |
JESD-30 code | S-PBGA-B532 |
JESD-609 code | e1 |
length | 23 mm |
low power mode | YES |
Humidity sensitivity level | 4 |
Number of terminals | 532 |
Maximum operating temperature | 90 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA532,26X26,32 |
Package shape | SQUARE |
Package form | GRID ARRAY, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.1,3.3 V |
Certification status | Not Qualified |
RAM (number of words) | 262144 |
Maximum seat height | 3.3 mm |
Maximum supply voltage | 1.16 V |
Minimum supply voltage | 1.05 V |
Nominal supply voltage | 1.1 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 23 mm |
uPs/uCs/peripheral integrated circuit type | DIGITAL SIGNAL PROCESSOR, OTHER |