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Datasheet> All Categories > logic> logic> M74HCT573M1
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M74HCT573M1

Description
HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, MICRO, PLASTIC, DIP-20
Categorylogic    logic   
File Size159KB，6 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

M74HCT573M1 Overview

HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, MICRO, PLASTIC, DIP-20

M74HCT573M1 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeSOIC
package instructionSOP, SOP20,.4
Contacts20
Reach Compliance Codenot_compliant
Other featuresBROADSIDE VERSION OF 373
seriesHCT
JESD-30 codeR-PDSO-G20
JESD-609 codee0
length12.8 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.006 A
Number of digits8
Number of functions1
Number of ports2
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP20,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Prop。Delay @ Nom-Sup44 ns
propagation delay (tpd)44 ns
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.5 mm

M74HCT573M1 Related Products

M74HCT573M1 M74HCT573C1 M74HCT573F1 M54HCT573F1 M74HCT563F1 M74HCT563B1N M74HCT563C1 M74HCT573B1N M54HCT563F1 M74HCT563M1
Description HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, MICRO, PLASTIC, DIP-20 HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PQCC20, PLASTIC, CC-20 HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, FRIT SEALED, CERAMIC, DIP-20 HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, FRIT SEALED, CERAMIC, DIP-20 HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP20, FRIT SEALED, CERAMIC, DIP-20 HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20, PLASTIC, DIP-20 HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PQCC20, PLASTIC, CC-20 HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, PLASTIC, DIP-20 HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP20, FRIT SEALED, CERAMIC, DIP-20 HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, MICRO, PLASTIC, DIP-20
Parts packaging code SOIC QFN DIP DIP DIP DIP QFN DIP DIP SOIC
package instruction SOP, SOP20,.4 PLASTIC, CC-20 FRIT SEALED, CERAMIC, DIP-20 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 QCCJ, LDCC20,.4SQ PLASTIC, DIP-20 DIP, DIP20,.3 SOP, SOP20,.4
Contacts 20 20 20 20 20 20 20 20 20 20
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant unknown not_compliant not_compliant
Other features BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 533 BROADSIDE VERSION OF 533 BROADSIDE VERSION OF 533 BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 533 BROADSIDE VERSION OF 533
series HCT HCT HCT HCT HCT HCT HCT HCT HCT HCT
JESD-30 code R-PDSO-G20 S-PQCC-J20 R-GDIP-T20 R-GDIP-T20 R-GDIP-T20 R-PDIP-T20 S-PQCC-J20 R-PDIP-T20 R-GDIP-T20 R-PDSO-G20
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Number of digits 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of ports 2 2 2 2 2 2 2 2 2 2
Number of terminals 20 20 20 20 20 20 20 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 125 °C 85 °C 85 °C 85 °C 85 °C 125 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -55 °C -40 °C -40 °C -40 °C -40 °C -55 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE INVERTED INVERTED INVERTED TRUE INVERTED INVERTED
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code SOP QCCJ DIP DIP DIP DIP QCCJ DIP DIP SOP
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE CHIP CARRIER IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE SMALL OUTLINE
propagation delay (tpd) 44 ns 44 ns 44 ns 53 ns 44 ns 44 ns 44 ns 44 ns 53 ns 44 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 4.57 mm 5 mm 5 mm 5 mm 3.93 mm 4.57 mm 3.93 mm 5 mm 2.65 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO NO NO NO YES NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY INDUSTRIAL
Terminal form GULL WING J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL QUAD DUAL DUAL DUAL DUAL QUAD DUAL DUAL DUAL
width 7.5 mm 8.9662 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 8.9662 mm 7.62 mm 7.62 mm 7.5 mm
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead - Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible - incompatible incompatible
Maker STMicroelectronics STMicroelectronics STMicroelectronics - - STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
JESD-609 code e0 e0 e0 e0 e0 e0 e0 - e0 e0
MaximumI(ol) 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A - 0.006 A 0.006 A
Encapsulate equivalent code SOP20,.4 LDCC20,.4SQ DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 LDCC20,.4SQ - DIP20,.3 SOP20,.4
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V - 5 V 5 V
Prop。Delay @ Nom-Sup 44 ns 44 ns 44 ns 53 ns 46 ns 46 ns 46 ns - 56 ns 46 ns
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED

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