EEPROM, 16KX8, Serial, CMOS, PDSO16, PLASTIC, SOIC-16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Xicor Inc. |
package instruction | PLASTIC, SOIC-16 |
Reach Compliance Code | unknown |
Maximum clock frequency (fCLK) | 0.4 MHz |
Data retention time - minimum | 100 |
Durability | 1000000 Write/Erase Cycles |
I2C control byte | 1010DDDR |
JESD-30 code | R-PDSO-G16 |
JESD-609 code | e0 |
length | 9.9 mm |
memory density | 131072 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 16 |
word count | 16384 words |
character code | 16000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP16,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
power supply | 2/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Serial bus type | I2C |
Maximum standby current | 0.000001 A |
Maximum slew rate | 0.003 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 3.9 mm |
Maximum write cycle time (tWC) | 10 ms |
write protect | HARDWARE |
X24129S-1.8 | X24129S-2.5 | X24129SI-1.8 | X24129SI-2.5 | X24129S | X24129SI | |
---|---|---|---|---|---|---|
Description | EEPROM, 16KX8, Serial, CMOS, PDSO16, PLASTIC, SOIC-16 | EEPROM, 16KX8, Serial, CMOS, PDSO16, PLASTIC, SOIC-16 | EEPROM, 16KX8, Serial, CMOS, PDSO16, PLASTIC, SOIC-16 | EEPROM, 16KX8, Serial, CMOS, PDSO16, PLASTIC, SOIC-16 | EEPROM, 16KX8, Serial, CMOS, PDSO16, PLASTIC, SOIC-16 | EEPROM, 16KX8, Serial, CMOS, PDSO16, PLASTIC, SOIC-16 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Xicor Inc. | Xicor Inc. | Xicor Inc. | Xicor Inc. | Xicor Inc. | Xicor Inc. |
package instruction | PLASTIC, SOIC-16 | PLASTIC, SOIC-16 | PLASTIC, SOIC-16 | PLASTIC, SOIC-16 | PLASTIC, SOIC-16 | PLASTIC, SOIC-16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum clock frequency (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
Data retention time - minimum | 100 | 100 | 100 | 100 | 100 | 100 |
Durability | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
I2C control byte | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
JESD-30 code | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
length | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm |
memory density | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 |
word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
character code | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C |
organize | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP | SOP | SOP | SOP | SOP |
Encapsulate equivalent code | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
power supply | 2/3.3 V | 3/5 V | 2/3.3 V | 3/5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
Serial bus type | I2C | I2C | I2C | I2C | I2C | I2C |
Maximum slew rate | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
Maximum supply voltage (Vsup) | 3.6 V | 5.5 V | 3.6 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 1.8 V | 2.5 V | 1.8 V | 2.5 V | 4.5 V | 4.5 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
write protect | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
Maximum standby current | 0.000001 A | - | 0.000001 A | - | 0.000003 A | 0.000003 A |