Parallel IO Port, CMOS, CDIP40,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Tundra Semiconductor Corp |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T40 |
JESD-609 code | e0 |
Number of terminals | 40 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Maximum slew rate | 10 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
CA82C55A-10ED | CA82C55A-10CD | CA82C55A-10ID | CA82C55A-8CD | CA82C55A-5CD | CA82C55A-8ID | CA82C55A-8ED | CA82C55A-5ED | CA82C55A-5ID | |
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Description | Parallel IO Port, CMOS, CDIP40, | Parallel IO Port, CMOS, CDIP40, | Parallel IO Port, CMOS, CDIP40, | Parallel IO Port, CMOS, CDIP40, | Parallel IO Port, CMOS, CDIP40, | Parallel IO Port, CMOS, CDIP40, | Parallel IO Port, CMOS, CDIP40, | Parallel IO Port, CMOS, CDIP40, | Parallel IO Port, CMOS, CDIP40, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
Maximum operating temperature | 125 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 125 °C | 125 °C | 85 °C |
Minimum operating temperature | -55 °C | - | -40 °C | - | - | -40 °C | -55 °C | -55 °C | -40 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum slew rate | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maker | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | - | - | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp | Tundra Semiconductor Corp |