Power Supply Support Circuit, Fixed, 1 Channel, BICMOS, PBGA4, BUMP, UCSP-4
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | BGA |
| package instruction | BUMP, UCSP-4 |
| Contacts | 4 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Adjustable threshold | NO |
| Analog Integrated Circuits - Other Types | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 code | S-PBGA-B4 |
| JESD-609 code | e0 |
| length | 1.1 mm |
| Humidity sensitivity level | 1 |
| Number of channels | 1 |
| Number of functions | 1 |
| Number of terminals | 4 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 245 |
| Certification status | Not Qualified |
| Maximum seat height | 0.67 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.2 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 1.1 mm |
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