Support Circuit, 1-Func, 3 X 3 MM, LEAD FREE, MLF-16
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Micrel ( Microchip ) |
Parts packaging code | DFN |
package instruction | HVQCCN, LCC16,.12SQ,20 |
Contacts | 16 |
Manufacturer packaging code | MLF |
Reach Compliance Code | compliant |
app | SONET;SDH |
JESD-30 code | S-XQCC-N16 |
JESD-609 code | e4 |
length | 3 mm |
Humidity sensitivity level | 2 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | UNSPECIFIED |
encapsulated code | HVQCCN |
Encapsulate equivalent code | LCC16,.12SQ,20 |
Package shape | SQUARE |
Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 0.9 mm |
Maximum slew rate | 0.065 mA |
Nominal supply voltage | 3.3 V |
surface mount | YES |
Telecom integrated circuit types | ATM/SONET/SDH SUPPORT CIRCUIT |
Temperature level | INDUSTRIAL |
Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 40 |
width | 3 mm |