REVISIONS
LTR
C
DESCRIPTION
Add device types 03, 04, 05, 06, and 07. Add approved source CAGE
66632. Add case outline Y. Editorial changes throughout. Change to
military drawing format and new code ident. no. 67268.
Make changes to table I, table II, 1.2.2, 3.3, 4.3.1, 4.3.2, and figures 1, 2,
3, and 4.
Added devices 08 and 09. Remove CAGE number 66632 as a supplier.
Updated boilerplate, editorial changes throughout.
DATE
(YR-MO-DA)
1987 OCT 23
APPROVED
M. A. Frye
D
E
1989 JAN 03
1993 OCT 12
M. A. Frye
M. A. Frye
DEVICES 8102401VX AND 8102402VX ARE
INACTIVE FOR NEW DESIGNS AS OF 22 OCT 1985.
USE M38510/24501BVX OR M38510/24502BVX
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
D
15
D
16
D
17
D
18
D
19
D
20
D
21
E
1
C
22
E
2
E
23
E
3
E
24
E
4
E
25
E
5
E
26
E
6
E
27
E
7
E
8
E
9
E
10
E
11
E
12
D
13
D
14
REV
SHEET
PMIC N/A
PREPARED BY
Kenneth Rice
STANDARDIZED
MILITARY
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
CHECKED BY
Ray Monnin
APPROVED BY
Michael A. Frye
MICROCIRCUIT, DIGITAL, CMOS, 4096 BIT, STATIC RANDOM
ACCESS MEMORY (SRAM), MONOLITHIC SILICON
DRAWING APPROVAL DATE
10 AUGUST 1982
SIZE
REVISION LEVEL
E
CAGE CODE
A
SHEET
1
67268
OF
27
81024
AMSC N/A
DESC FORM 193
JUL 91
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E420-93
1. SCOPE
1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883,
"Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
81024
*
*
*
*
01
*
*
*
*
X
*
*
*
*
X
*
*
*
*
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device types. The device types shall identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
Generic number 1/
Access time
120 ns
120 ns
200 ns
200 ns
300 ns
300 ns
55 ns
80 ns
80 ns
Circuit
4096-word x 1-bit static random access memory
1024-word x 4-bit static random access memory
4096-word x 1-bit static random access memory
1024-word x 4-bit static random access memory
4096-word x 1-bit static random access memory
1024-word x 4-bit static random access memory
4096-word x 1-bit static random access memory
4096-word x 1-bit static random access memory
4096-word x 1-bit static random access memory
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
V
X
Y
Descriptive designator
GDIP1-T18 or CDIP2-T18
CQCC1-N18
See figure 1
Terminals
18
18
18
Package style
Dual-in-line package
Rectangular chip carrier package
Flat package
1.2.3 Lead finish. The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit
or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and
interchangeable without preference.
1.3 Absolute maximum ratings.
Supply voltage range (VDD) (device type 07, 08, and 09) . . . . . . . . . . . . . . .
Supply voltage range (VDD) (device type 01-06) . . . . . . . . . . . . . . . . . . . . . .
Temperature under bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation (PD) 2/ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal resistance, junction-to-case (
1
JC):
Cases V and X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case Y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
All input or output voltages with
respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VSS -0.5 V to +7.0 V
VSS -0.3 V to +8.0 V
-55
E
C to +125
E
C
-65
E
C to +150
E
C
200 mW
+260
E
C
See MIL-STD-1835
40
E
C/W 3/
+150
E
C
VSS -0.3 V to VCC +0.3 V
1/ Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin at the
end of this document and will also be listed in MIL-BUL-103.
2/ Must withstand the added PD due to short circuit test; e.g., IOS.
3/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value
indicated herein.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
E
81024
SHEET
2
1.4 Recommended operating conditions.
Supply voltage range (VDD - VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input low (VIL) voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input high (VIH) voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input high (VIH) voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case operating temperature range (TC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip enable output enable time (TELQX) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip enable output disable time (TEHQZ):
Device types 01 and 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device types 03 and 04 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device types 05 and 06 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device type 07, 08, 09 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and bulletin. Unless otherwise specified, the following specification, standards, and
bulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the
solicitation, form a part of this drawing to the extent specified herein.
SPECIFICATION
MILITARY
MIL-M-38510 - Microcircuits, General Specification for.
STANDARDS
MILITARY
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
MIL-STD-1835 - Microcircuit Case Outlines.
BULLETIN
MILITARY
MIL-BUL-103 - List of Standardized Military Drawings (SMD's).
(Copies of the specification, standards, and bulletin required by manufacturers in connection with specific acquisition functions
should be obtained from the contracting activity or as directed by the contracting activity.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing shall take precedence.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the
use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-M-38510 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Logic diagram(s). The logic diagram(s) shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full case operating temperature range.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
4.5 V dc to 5.5 V dc
VSS -0.3 V dc to VSS +0.8 V dc
VDD -2.0 V dc to VDD +0.3 V dc
2.0 V dc to 6.0 V dc
-55
E
C to +125
E
C
5 ns minimum
70 ns maximum
80 ns maximum
100 ns maximum
30 ns maximum
A
REVISION LEVEL
E
81024
SHEET
3
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the PIN listed in
1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-103 (see 6.6 herein).
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-BUL-103 (see 6.6 herein). The certificate of compliance submitted to DESC-EC prior to listing as
an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-STD-883 (see 3.1 herein)
and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DESC-EC shall be required in accordance with MIL-STD-883 (see 3.1
herein).
3.9 Verification and review. DESC, DESC's agent, and the acquiring activity retain the option to review the manufacturer's facility
and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to the
extent specified in MIL-STD-883 (see 3.1 herein).
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
TA = +125
E
C, minimum.
(2)
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883
including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a.
b.
c.
Tests shall be as specified in table II herein.
Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
Subgroup 4 (CIN measurement) shall be measured only for the initial test and after process or design changes which
may affect input capacitance.
Subgroups 7 and 8 shall include verification of the truth table.
d.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
E
81024
SHEET
4
TABLE I. Electrical performance characteristics.
*
*
Symbol
*
*
*
*
*
VOL
*
*
*
VOH
*
*
*
VIC
*
(pos)
*
*
*
VIC
*
(neg)
*
*
*
IIH,
*
IIL
*
*
*
*
IOZ
*
*
*
*
*
IDD
*
*
*
*
*
*
*
*
IDR
*
*
*
*
*
*
*
*
IDDOP
*
*
*
*
IOS
*
*
*
*
IDD
*
*
*
Conditions
*
VSS = 0 V,
*
4.5 V
#
VDD
#
5.5 V
*
-55
E
C
#
TC
#
+125
E
C 1/
*
unless otherwise specified
*
*
VDD = 4.5 V, IOL = 2 mA
*
*
*
VDD = 4.5 V, IOH = -1 mA
*
*
*
TC = +25
E
C, VSS = 0.0 V,
*
IIN = 100 µA
*
*
*
TC = +25
E
C, VSS = 0.0 V,
*
IIN = -100 µA
*
*
*
VDD = 5.5 V
*
VIN = 0.0 V or 5.5 V
*
*
*
*
VDD = 5.5 V
*
VO = VDD
*
*
*
*
VDD = 5.5 V, VIN = VDD and GND,
*
*
IO = 0.0 mA; CE = VDD -0.3 V
$$
*
*
*
*
*
*
VDD = 2.0 V minimum, VIN = VDD
*
*
and GND, IO = 0.0 mA,
$
E = VDD
C
$
*
*
*
VDD = 2.5 V minimum
*
*
*
VDD = 5.5 V, f = 1 MHz,
*
IO = O mA, VIN = VDD 2/
*
*
*
VDD = 5.5 V, VOUT = GND
*
*
*
*
VDD = 5.5 V, IO = 0 mA
*
*
*
*
Group A
*
subgroups
*
*
*
*
1, 2, 3
*
*
*
1, 2, 3
*
*
*
1
*
*
*
*
1
*
*
*
*
1, 2, 3
*
*
*
*
*
1, 2, 3
*
*
*
*
*
1, 2, 3
*
*
*
*
1
*
*
2, 3
*
*
1, 2, 3
*
*
*
*
*
1
*
2, 3
*
*
1, 2, 3
*
*
*
*
1, 2, 3
*
*
*
*
1, 2, 3
*
*
*
*
Device
*
type
*
*
*
*
All
*
*
*
All
*
*
01, 02,
*
03, 04,
*
05, 06
*
*
01, 02,
*
03, 04,
*
05, 06
*
*
*
01, 02,
*
03, 04,
*
05, 06
*
07,08,09
*
*
01, 02,
*
03, 04,
*
05, 06
*
07,08,09
*
*
01, 02,
*
03, 04,
*
05, 06
*
*
07,08,09
*
*
*
*
01, 02,
*
03, 04,
*
05, 06
*
*
*
08, 09
*
*
*
01, 02,
*
03, 04,
*
05, 06
*
*
07
*
*
*
*
07
*
*
08, 09
*
*
Limits
*
*
*
Min
*
Max
*
*
*
*
*
*
0.4
*
*
*
*
*
2.4
*
*
*
*
*
*
0.2
*
2.0
*
*
*
*
*
*
*
-0.2
*
-2.0
*
*
*
*
*
*
*
-0.1
*
1.0
*
*
*
*
*
-10.0
*
10.0
*
*
*
-1.0
*
1.0
*
*
*
*
*
-10
*
10
*
*
*
*
50
*
*
*
*
*
*
*
*
100
*
*
*
*
1000
*
*
*
*
25
*
*
*
*
*
*
*
*
*
*
40
*
*
400
*
*
*
*
7
*
*
*
*
*
*
*
*
-350
*
*
*
*
*
*
*
*
140
*
*
4.5
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
Test
Unit
Low level output
voltage
High level output
voltage
Positive clamping
input to VDD
Negative clamping
input to VSS
Input leakage
current
V
V
V
V
µA
High impedance
output leakage
current
µA
Quiescent supply
current
µA
Data retention
supply current
µA
Operating current
mA
Output short
circuit current 3/
mA
Operating supply
current
mA
See footnotes at end of table.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
E
81024
SHEET
5
Altera SoC
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