Dual-Port SRAM, 128KX18, 15ns, PBGA208, FBGA-208
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | BGA |
| package instruction | TFBGA, |
| Contacts | 208 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 15 ns |
| Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| JESD-30 code | S-PBGA-B208 |
| JESD-609 code | e1 |
| length | 15 mm |
| memory density | 2359296 bit |
| Memory IC Type | DUAL-PORT SRAM |
| memory width | 18 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 208 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX18 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 3.45 V |
| Minimum supply voltage (Vsup) | 3.15 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| width | 15 mm |
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