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S29GL256M11FFIR12

Description
Flash, 16MX16, 110ns, PBGA64, 18 X 12 MM, LEAD FREE, FORTIFIED, BGA-64
Categorystorage    storage   
File Size6MB,116 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
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S29GL256M11FFIR12 Overview

Flash, 16MX16, 110ns, PBGA64, 18 X 12 MM, LEAD FREE, FORTIFIED, BGA-64

S29GL256M11FFIR12 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instruction18 X 12 MM, LEAD FREE, FORTIFIED, BGA-64
Contacts64
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time110 ns
Spare memory width8
startup blockBOTTOM/TOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B64
JESD-609 codee1
length18 mm
memory density268435456 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of departments/size512
Number of terminals64
word count16777216 words
character code16000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA64,8X8,40
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
page size4/8 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.4 mm
Department size64K
Maximum standby current0.000005 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
switch bitYES
typeNOR TYPE
width12 mm

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