Flash, 16MX16, 110ns, PBGA64, 18 X 12 MM, LEAD FREE, FORTIFIED, BGA-64
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SPANSION |
Parts packaging code | BGA |
package instruction | 18 X 12 MM, LEAD FREE, FORTIFIED, BGA-64 |
Contacts | 64 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.1.A |
Maximum access time | 110 ns |
Spare memory width | 8 |
startup block | BOTTOM/TOP |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B64 |
JESD-609 code | e1 |
length | 18 mm |
memory density | 268435456 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of departments/size | 512 |
Number of terminals | 64 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 16MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA64,8X8,40 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE |
page size | 4/8 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.4 mm |
Department size | 64K |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.06 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
switch bit | YES |
type | NOR TYPE |
width | 12 mm |