IC 1M X 8 FAST PAGE DRAM MODULE, 60 ns, SMA30, SIMM-30, Dynamic RAM
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Toshiba Semiconductor |
Parts packaging code | SIMM |
package instruction | , |
Contacts | 30 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 60 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 code | R-XSMA-T30 |
JESD-609 code | e0 |
memory density | 8388608 bit |
Memory IC Type | FAST PAGE DRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 30 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX8 |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal location | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED |
THM81000BL-60 | THM81000BSG-60 | THM81000BS-60 | |
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Description | IC 1M X 8 FAST PAGE DRAM MODULE, 60 ns, SMA30, SIMM-30, Dynamic RAM | IC 1M X 8 FAST PAGE DRAM MODULE, 60 ns, SMA30, SIMM-30, Dynamic RAM | IC 1M X 8 FAST PAGE DRAM MODULE, 60 ns, SMA30, SIMM-30, Dynamic RAM |
Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
Parts packaging code | SIMM | SIMM | SIMM |
Contacts | 30 | 30 | 30 |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |
access mode | FAST PAGE | FAST PAGE | FAST PAGE |
Maximum access time | 60 ns | 60 ns | 60 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 code | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-N30 |
memory density | 8388608 bit | 8388608 bit | 8388608 bit |
Memory IC Type | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
memory width | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 |
Number of terminals | 30 | 30 | 30 |
word count | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 1MX8 | 1MX8 | 1MX8 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD |
Terminal location | SINGLE | SINGLE | SINGLE |