HC6664/1XSH-C datasheet, PDF - EEWORLD Datasheet

HC6664/1XSH-C: DescriptionOTP ROM, 8KX8, 55ns, CMOS, CDFP36, 0.630 X 0.630 INCH, CERAMIC, FP-36; Categorystorage storage; File Size392KB，10 Pages; ManufacturerHoneywell; Websitehttp://www.ssec.honeywell.com/

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HC6664/1XSH-C Overview

OTP ROM, 8KX8, 55ns, CMOS, CDFP36, 0.630 X 0.630 INCH, CERAMIC, FP-36

Parameter Name	Attribute value
Maker	Honeywell
Parts packaging code	DFP
package instruction	WDFP,
Contacts	36
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	55 ns
Other features	RADIATION-HARDENED ROM
JESD-30 code	S-CDFP-F36
length	16.002 mm
memory density	65536 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	36
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WDFP
Package shape	SQUARE
Package form	FLATPACK, WINDOW
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.5052 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	0.635 mm
Terminal location	DUAL
width	16.002 mm

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Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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