CABGA-256, Tray
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | CABGA |
| package instruction | BGA, BGA256,16X16,40 |
| Contacts | 256 |
| Manufacturer packaging code | BC256 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A991.B.2.A |
| Samacsys Description | CHIP ARRAY BGA 17.0 X 1.7.0 MM X 1.0 MM |
| Maximum access time | 4.2 ns |
| Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| Maximum clock frequency (fCLK) | 133 MHz |
| I/O type | COMMON |
| JESD-30 code | S-PBGA-B256 |
| JESD-609 code | e0 |
| memory density | 2359296 bit |
| Memory IC Type | APPLICATION SPECIFIC SRAM |
| memory width | 18 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 256 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX18 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA256,16X16,40 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 2.5/3.3,3.3 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.03 A |
| Minimum standby current | 3.15 V |
| Maximum slew rate | 0.4 mA |
| Maximum supply voltage (Vsup) | 3.45 V |
| Minimum supply voltage (Vsup) | 3.15 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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