CJ7905F-TO-220F datasheet, PDF

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CJ7905F-TO-220F: DescriptionThree-terminal negative voltage regulator; File Size97KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

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Three-terminal negative voltage regulator

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JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-220F Plastic-Encapsulate Voltage Regulator

CJ7905F

Three-terminal negative voltage regulator

FEATURES

Maximum Output

Current

: 1.5 A

Output voltage

o :

-5 V

TO-220F

GND

OUT

ABSOLUTE MAXIMUM RATINGSO ( perating temperature range applies unless otherwise specified)

Parameter

Input Voltage

Operating Junction Temperature Range

Storage Temperature Range

Symbol

OPR

STG

Value

-35

0-+150

-65-+150

Unit

℃

ELECTRICAL CHARACTERISTICS

(Vi=-10V, Io= 500mA, 0℃<T

<125℃,Ci=2μF, Co=0.1μF, unless otherwise specified )

Parameter

Output voltage

Symbol

=25℃

-7V≤V

≤-20V,

Io=5mA-1A P≤15W

=25℃, Io=5mA-1.5A

=25℃, Io=250mA-750mA

-7V≤V

≤-25V,

=25℃

-8V≤V

≤-12V,

=25℃

-7

V≤V

≤

-25

5mA≤I

≤1A

10Hz≤f≤100KHz

-8V≤V

≤-18V,

f=120Hz, T

=25℃

=25℃, Io=1A

=25℃

CJ7905F

UTC

2μF

1μF

Test conditions

MIN

-4.8

-4.75

TYP

-5

12.5

1.5

0.15

0.08

125

1.1

2.1

MAX

-5.2

-5.25

100

0.5

UNIT

µV

Load Regulation

∆Vo

∆Iq

Ipk

Line regulation

Quiescent Current

Quiescent

Change

Output Noise Voltage

Ripple Rejection

Dropout Voltage

Peak Current

Current

TYPICAL APPLICATION

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