IBM04368CBLBC-25 datasheet, PDF

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IBM04368CBLBC-25: DescriptionStandard SRAM, 256KX36, 1.8ns, CMOS, PBGA153, BGA-153; Categorystorage storage; File Size315KB，24 Pages; ManufacturerIBM; Websitehttp://www.ibm.com

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IBM04368CBLBC-25 Overview

Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA153, BGA-153

IBM04368CBLBC-25 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IBM
Parts packaging code	BGA
package instruction	BGA, BGA153,9X17,50
Contacts	153
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	1.8 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	400 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B153
JESD-609 code	e0
length	22 mm
memory density	9437184 bit
Memory IC Type	STANDARD SRAM
memory width	36
Number of functions	1
Number of terminals	153
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	256KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA153,9X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8,2.5 V
Certification status	Not Qualified
Maximum seat height	2.679 mm
Maximum standby current	0.15 A
Minimum standby current	2.38 V
Maximum slew rate	0.75 mA
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

IBM04368CBLBC-25 Related Products

	IBM04368CBLBC-25	IBM04368CBLBC-28	IBM04368CBLBC-30
Description	Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA153, BGA-153	Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA153, BGA-153	Standard SRAM, 256KX36, 1.7ns, CMOS, PBGA153, BGA-153
Is it lead-free?	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	IBM	IBM	IBM
Parts packaging code	BGA	BGA	BGA
package instruction	BGA, BGA153,9X17,50	BGA, BGA153,9X17,50	BGA, BGA153,9X17,50
Contacts	153	153	153
Reach Compliance Code	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	1.8 ns	1.8 ns	1.7 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	400 MHz	357 MHz	333 MHz
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B153	R-PBGA-B153	R-PBGA-B153
JESD-609 code	e0	e0	e0
length	22 mm	22 mm	22 mm
memory density	9437184 bit	9437184 bit	9437184 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	36	36	36
Number of functions	1	1	1
Number of terminals	153	153	153
word count	262144 words	262144 words	262144 words
character code	256000	256000	256000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
organize	256KX36	256KX36	256KX36
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA
Encapsulate equivalent code	BGA153,9X17,50	BGA153,9X17,50	BGA153,9X17,50
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	1.8,2.5 V	1.8,2.5 V	1.8,2.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.679 mm	2.679 mm	2.679 mm
Maximum standby current	0.15 A	0.15 A	0.15 A
Minimum standby current	2.38 V	2.38 V	2.38 V
Maximum supply voltage (Vsup)	2.625 V	2.625 V	2.625 V
Minimum supply voltage (Vsup)	2.375 V	2.375 V	2.375 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	14 mm
Maximum slew rate	0.75 mA	-	0.64 mA

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