SMBG5925B datasheet, PDF - EEWORLD Datasheet

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SMBG5925B: DescriptionZener Diode, 10V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-215AA, PLASTIC, SMBG, 2 PIN; CategoryDiscrete semiconductor diode; File Size172KB，3 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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SMBG5925B Overview

Zener Diode, 10V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-215AA, PLASTIC, SMBG, 2 PIN

SMBG5925B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1363302173
Parts packaging code	DO-215AA
package instruction	R-PDSO-G2
Contacts	2
Reach Compliance Code	not_compliant
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JEDEC-95 code	DO-215AA
JESD-30 code	R-PDSO-G2
JESD-609 code	e0
Humidity sensitivity level	1
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	235
polarity	UNIDIRECTIONAL
Maximum power dissipation	1.25 W
Nominal reference voltage	10 V
surface mount	YES
technology	ZENER
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	20
Maximum voltage tolerance	5%
Working test current	37.5 mA

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SMBG5913 thru SMBG5956B

SMBJ5913 thru SMBJ5956B

SILICON 3.0 Watt ZENER DIODES

SCOTTSDALE DIVISION

DESCRIPTION

The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 3.0

watt Zeners provides voltage regulation in a selection from 3.3 to 200

volts with different tolerances as identified by suffix letter on the part

number. This series is equivalent to the JEDEC registered 1N5913 thru

1N5956B with identical electrical characteristics except it is rated at 3.0 W

instead of 1.5 W with the lower thermal resistance features of the surface

mount packaging. It is available in J-bend design (SMBJ) with the DO-

214AA package for greater PC board mounting density or in Gull-wing

design (SMBG) in the DO-215AA for visible solder connections.

Microsemi also offers numerous other Zener products to meet higher and

lower power applications.

IMPORTANT:

For the most current data, consult

MICROSEMI’s

website:

http://www.microsemi.com

APPEARANCE

WWW .

Microsemi

NOTE: All SMB series are

equivalent to prior SMS package

identifications.

FEATURES

•

Surface mount equivalent to 1N5913 to 1N5956B

Ideal for high-density and low-profile mounting

Zener voltage available 3.3V to 200V

Standard voltage tolerances are plus/minus 5%

with B suffix and 10 % with A suffix identification

Tight tolerances available in plus or minus 2% or

1% with C or D suffix respectively

Options for screening in accordance with MIL-PRF-

19500 for JAN, JANTX, JANTXV, and JANS are

available by adding MQ, MX, MV, or MSP prefixes

respectively to part numbers.

APPLICATIONS / BENEFITS

•

Regulates voltage over a broad operating

current and temperature range

Wide selection from 3.3 to 200 V

Popular DO-214AA or DO-215AA packages

and footprints for either high density J-bend or

Gull-wing designs for visible solder joints

Nonsensitive to ESD per MIL-STD-750 Method

1020

Withstands high surge stresses (see Figure 2)

Moisture classification: Level 1 per IPC/JEDEC

J-STD-020B with no dry pack required

MECHANICAL AND PACKAGING

•

CASE: Void-free transfer molded thermosetting

epoxy body meeting UL94V-0

•

TERMINALS: Gull-wing or C-bend (modified J-

bend) leads, tin-lead plated solderable per MIL-

STD-750, method 2026

•

POLARITY: Cathode indicated by band. Diode

to be operated with banded end positive with

respect to opposite end for Zener regulation

•

MARKING: Includes part number without prefix

(e.g. 5913B, 5948C, 5956D, etc.)

•

TAPE & REEL option: Standard per EIA-481-2

with 12 mm tape, 750 per 7 inch reel or 2500

per 13 inch reel

(add “TR” suffix to part number)

•

WEIGHT: 0.1 grams

•

See package dimensions on last page

MAXIMUM RATINGS

•

Power dissipation at 25

C: 3.0 watts (also see

derating in Figure 1).

Operating and Storage temperature: -65

C to

+150

Thermal Resistance: 25

C/W junction to lead, or

C/W junction to ambient when mounted on

FR4 PC board (1oz Cu) with recommended

footprint (see last page)

Steady-State Power: 3 watts at T

< 75

C, or

1.38 watts at T

= 25

C when mounted on FR4

PC board with recommended footprint (also see

Figure 1)

Forward voltage @200 mA: 1.2 volts (maximum)

Solder Temperatures: 260

C for 10 s (maximum)

SMBG & J5913 thru 5956B

•



2002

6-04-2003 REV C

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

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