EEPROM, 8KX8, 70ns, Parallel, CMOS, PDIP28, 0.600 INCH, PLASTIC, MS-011AB, DIP-28
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Atmel (Microchip) |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 28 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 70 ns |
Other features | 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; AUTOMATIC PAGE WRITE |
Data retention time - minimum | 10 |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PDIP-T28 |
JESD-609 code | e3 |
length | 37.0205 mm |
memory density | 65536 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.826 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 15.24 mm |
Maximum write cycle time (tWC) | 10 ms |