Memory Circuit, 8MX16, CMOS, PBGA48, 10 X 11 MM, LEAD FREE COMPLIANT, FBGA-48
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SPANSION |
| Parts packaging code | BGA |
| package instruction | TFBGA, |
| Contacts | 48 |
| Reach Compliance Code | compliant |
| Other features | PSRAM IS ORGANIZED AS 1M X 16, SYNCHRONOUS BURST MODE ALSO POSSIBLE |
| JESD-30 code | R-PBGA-B48 |
| JESD-609 code | e0 |
| length | 10.95 mm |
| memory density | 134217728 bit |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 48 |
| word count | 8388608 words |
| character code | 8000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| organize | 8MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 1.95 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | TIN LEAD |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| width | 9.95 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD