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XC5VLX330-2FF1760I

Description
Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1760, 42.50 X 42.50 MM, FBGA-1760
CategoryProgrammable logic devices    Programmable logic   
File Size314KB,13 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
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XC5VLX330-2FF1760I Overview

Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1760, 42.50 X 42.50 MM, FBGA-1760

XC5VLX330-2FF1760I Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerXILINX
Parts packaging codeBGA
package instructionBGA-1760
Contacts1760
Reach Compliance Codenot_compliant
ECCN code3A001.A.7.A
Combined latency of CLB-Max0.77 ns
JESD-30 codeS-PBGA-B1760
JESD-609 codee0
length42.5 mm
Humidity sensitivity level4
Configurable number of logic blocks25920
Number of entries1200
Number of logical units331776
Output times1200
Number of terminals1760
Maximum operating temperature100 °C
Minimum operating temperature-40 °C
organize25920 CLBS
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA1760,42X42,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1,2.5 V
Programmable logic typeFPGA
Certification statusNot Qualified
Maximum seat height3.5 mm
Maximum supply voltage1.05 V
Minimum supply voltage0.95 V
Nominal supply voltage1 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width42.5 mm

XC5VLX330-2FF1760I Related Products

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Description Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1760, 42.50 X 42.50 MM, FBGA-1760 Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, FBGA-1738 Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, LEAD FREE, FBGA-1738 CAP,AL2O3,100MF,80VDC,20% -TOL,20% +TOL Field Programmable Gate Array, 16320 CLBs, 1265MHz, 196608-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, FBGA-1738 Field Programmable Gate Array, 25920 CLBs, 1265MHz, 331776-Cell, CMOS, PBGA1760, 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 Field Programmable Gate Array, 18720 CLBs, 1265MHz, 239616-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, FBGA-1738 Field Programmable Gate Array, 18720 CLBs, 1265MHz, 239616-Cell, CMOS, PBGA1738, 42.50 X 42.50 MM, LEAD FREE, FBGA-1738
package instruction BGA-1760 BGA, BGA1738,42X42,40 BGA, BGA1738,42X42,40 , BGA-1738 BGA-1760 BGA-1738 BGA-1738
Reach Compliance Code not_compliant not_compliant not_compliant unknown not_compliant not_compliant _compli _compli
length 42.5 mm 42.5 mm 42.5 mm 140 mm 42.5 mm 42.5 mm 42.5 mm 42.5 mm
Number of terminals 1760 1738 1738 2 1738 1760 1738 1738
Maximum operating temperature 100 °C 100 °C 100 °C 105 °C 100 °C 100 °C 100 °C 100 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package form GRID ARRAY GRID ARRAY GRID ARRAY Screw Ends GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Is it Rohs certified? incompatible incompatible conform to - incompatible conform to incompatible conform to
Maker XILINX XILINX XILINX - XILINX XILINX XILINX XILINX
Parts packaging code BGA BGA BGA - BGA BGA BGA BGA
Contacts 1760 1738 1738 - 1738 1760 1738 1738
ECCN code 3A001.A.7.A 3A001.A.7.A 3A001.A.7.A EAR99 3A001.A.7.A 3A001.A.7.A - -
Combined latency of CLB-Max 0.77 ns 0.77 ns 0.77 ns - 0.77 ns 0.77 ns 0.77 ns 0.77 ns
JESD-30 code S-PBGA-B1760 S-PBGA-B1738 S-PBGA-B1738 - S-PBGA-B1738 S-PBGA-B1760 S-PBGA-B1738 S-PBGA-B1738
JESD-609 code e0 e0 e1 - e0 e1 e0 e1
Humidity sensitivity level 4 4 4 - 4 4 4 4
Configurable number of logic blocks 25920 25920 25920 - 15360 25920 18720 18720
Number of entries 1200 960 960 - 960 1200 960 960
Number of logical units 331776 331776 331776 - 196608 331776 239616 239616
Output times 1200 960 960 - 960 1200 960 960
organize 25920 CLBS 25920 CLBS 25920 CLBS - 15360 CLBS 25920 CLBS 18720 CLBS 18720 CLBS
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA - BGA BGA BGA BGA
Encapsulate equivalent code BGA1760,42X42,40 BGA1738,42X42,40 BGA1738,42X42,40 - BGA1738,42X42,40 BGA1760,42X42,40 BGA1738,42X42,40 BGA1738,42X42,40
Package shape SQUARE SQUARE SQUARE - SQUARE SQUARE SQUARE SQUARE
Peak Reflow Temperature (Celsius) 225 225 245 - 225 245 225 245
power supply 1,2.5 V 1,2.5 V 1,2.5 V - 1,2.5 V 1,2.5 V 1,2.5 V 1,2.5 V
Programmable logic type FPGA FPGA FPGA - FPGA FPGA FPGA FPGA
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.5 mm 3.25 mm 3.25 mm - 3.25 mm 3.5 mm 3.25 mm 3.25 mm
Maximum supply voltage 1.05 V 1.05 V 1.05 V - 1.05 V 1.05 V 1.05 V 1.05 V
Minimum supply voltage 0.95 V 0.95 V 0.95 V - 0.95 V 0.95 V 0.95 V 0.95 V
Nominal supply voltage 1 V 1 V 1 V - 1 V 1 V 1 V 1 V
surface mount YES YES YES - YES YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) - Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form BALL BALL BALL - BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm - 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 - 30 30 30 30
width 42.5 mm 42.5 mm 42.5 mm - 42.5 mm 42.5 mm 42.5 mm 42.5 mm

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