Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, CMOS, PBGA400, FBGA-400
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | XILINX |
| Parts packaging code | BGA |
| package instruction | FBGA-400 |
| Contacts | 400 |
| Reach Compliance Code | compliant |
| maximum clock frequency | 667 MHz |
| Combined latency of CLB-Max | 4.88 ns |
| JESD-30 code | S-PBGA-B400 |
| JESD-609 code | e0 |
| length | 21 mm |
| Humidity sensitivity level | 3 |
| Configurable number of logic blocks | 1472 |
| Equivalent number of gates | 700000 |
| Number of terminals | 400 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| organize | 1472 CLBS, 700000 GATES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | 225 |
| Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
| Certification status | Not Qualified |
| Maximum seat height | 2.43 mm |
| Maximum supply voltage | 1.26 V |
| Minimum supply voltage | 1.14 V |
| Nominal supply voltage | 1.2 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | TIN LEAD |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| width | 21 mm |
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