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SMCJ54AP

Description
DIODE 1500 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMC, 2 PIN, Transient Suppressor
CategoryDiscrete semiconductor    diode   
File Size126KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance  
Download Datasheet Parametric View All

SMCJ54AP Overview

DIODE 1500 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMC, 2 PIN, Transient Suppressor

SMCJ54AP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AB
package instructionROHS COMPLIANT, PLASTIC, SMC, 2 PIN
Contacts2
Reach Compliance Codeunknown
MCC
Micro Commercial Components
TM
Micro Commercial Components
20736 Marilla Street Chatsworth

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SMCJ5.0(C)A
THRU
SMCJ440(C)A
Transient
Voltage Suppressor
5.0 to 440 Volts
1500 Watt
DO-214AB
(SMC) (LEAD
FRAME)
G
Features
For surface mount application in order to optimize board space
Low inductance
Low profile package
Built-in strain relief
Glass passivated junction
Typical I
D
less than 1uA above 10V
High temperature soldering: 260 C/10 seconds at terminals
Plastic package has Underwrites Laboratory Flammability
Classification 94V-O
UL Recognized File # E222849
o
For Bidirectional Devices Add “C” To The Suffix Of The Part
Number: i.e.SMCJ5.0CA for 5% Tolerance
H
Mechanical Data
CASE: JEDEC DO-214AB molded plastic body over
passivated junction
Terminals: solderable per MIL-STD-750, Method 2026
D
A
C
E
B

F
Polarity: Color band denotes positive end( cathode) except
Bi-directional types.
Standard packaging: 16mm tape per ( EIA 481).
Weight: 0.007 ounce, 0.21 gram
DIM
A
B
C
D
E
F
G
H
INCHES
MIN
.079
.108
.002
.006
.030
..305
.260
.220
MAX
.103
.128
.008
.012
.050
.320
.280
.245
DIMENSIONS
MM
MIN
2.00
2.75
0.051
0.152
0.76
7.75
6.60
5.59
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Pulse Current on
I
PPM
See Table 1 Amps
10/1000us
waveform(Note1, Fig3)
Peak Pulse Power
P
PPM
Minimum Watts
Disspation on 10/1000us
1500
waveform(Note1,2,Fig1)
Peak forward surge
I
FSM)
200.0
Amps
current (JEDEC
Method) (Note 2,3)
Operation And Storage
T
J
,
-55
o
C to
Temperature Range
T
STG
+150
o
C
MAX
2.62
3.25
0.203
0.305
1.27
8.13
7.11
6.22
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.185
0.121”
0.060”
NOTES:
o
1.
Non-repetitive current pulse per Fig.3 and derated above TA=25 C per Fig.2.
2
2.
Mounted on 8.0mm copper pads to each terminal.
3.
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.
www.mccsemi.com
Revision :
9
1 of 5
2007/11/20

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