|
MR4A16BMYS35 |
MR4A16BMYS35R |
Description |
Memory Circuit, 1MX16, CMOS, PDSO54, ROHS COMPLIANT, MS-024, TSOP2-54 |
Memory Circuit, 1MX16, CMOS, PDSO54, ROHS COMPLIANT, MS-024, TSOP2-54 |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Everspin Technologies |
Everspin Technologies |
Parts packaging code |
TSSOP2 |
TSSOP2 |
package instruction |
TSOP2, TSOP54,.46,32 |
TSOP2, |
Contacts |
54 |
54 |
Reach Compliance Code |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
JESD-30 code |
R-PDSO-G54 |
R-PDSO-G54 |
length |
22.22 mm |
22.22 mm |
memory density |
16777216 bit |
16777216 bit |
Memory IC Type |
MEMORY CIRCUIT |
MEMORY CIRCUIT |
memory width |
16 |
16 |
Number of functions |
1 |
1 |
Number of terminals |
54 |
54 |
word count |
1048576 words |
1048576 words |
character code |
1000000 |
1000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
organize |
1MX16 |
1MX16 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSOP2 |
TSOP2 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1.2 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
3 V |
3 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
0.8 mm |
0.8 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
10.16 mm |
10.16 mm |