Fast Page DRAM, 4MX1, 120ns, CMOS, PZIP20, PLASTIC, ZIP-20
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Intel |
Parts packaging code | ZIP |
package instruction | ZIP, ZIP20,.1 |
Contacts | 20 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 120 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O type | SEPARATE |
JESD-30 code | R-PZIP-T20 |
JESD-609 code | e0 |
length | 26.162 mm |
memory density | 4194304 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 20 |
word count | 4194304 words |
character code | 4000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX1 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | ZIP |
Encapsulate equivalent code | ZIP20,.1 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum seat height | 10.16 mm |
self refresh | NO |
Maximum standby current | 0.001 A |
Maximum slew rate | 0.07 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 1.27 mm |
Terminal location | ZIG-ZAG |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 3 mm |
Z21040-12 | PE21040-08 | PE21040-10 | Z21040-08 | Z21040-10 | |
---|---|---|---|---|---|
Description | Fast Page DRAM, 4MX1, 120ns, CMOS, PZIP20, PLASTIC, ZIP-20 | Fast Page DRAM, 4MX1, 80ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Fast Page DRAM, 4MX1, 100ns, CMOS, PDSO20, PLASTIC, SOJ-26/20 | Fast Page DRAM, 4MX1, 80ns, CMOS, PZIP20, PLASTIC, ZIP-20 | Fast Page DRAM, 4MX1, 100ns, CMOS, PZIP20, PLASTIC, ZIP-20 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | ZIP | SOJ | SOJ | ZIP | ZIP |
package instruction | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | SOJ, SOJ20/26,.34 | ZIP, ZIP20,.1 | ZIP, ZIP20,.1 |
Contacts | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
Maximum access time | 120 ns | 80 ns | 100 ns | 80 ns | 100 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
JESD-30 code | R-PZIP-T20 | R-PDSO-J20 | R-PDSO-J20 | R-PZIP-T20 | R-PZIP-T20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
length | 26.162 mm | 17.145 mm | 17.145 mm | 26.162 mm | 26.162 mm |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
memory width | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 | 20 | 20 |
word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | ZIP | SOJ | SOJ | ZIP | ZIP |
Encapsulate equivalent code | ZIP20,.1 | SOJ20/26,.34 | SOJ20/26,.34 | ZIP20,.1 | ZIP20,.1 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 1024 | 1024 | 1024 | 1024 | 1024 |
Maximum seat height | 10.16 mm | 3.68 mm | 3.68 mm | 10.16 mm | 10.16 mm |
self refresh | NO | NO | NO | NO | NO |
Maximum standby current | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
Maximum slew rate | 0.07 mA | 0.1 mA | 0.085 mA | 0.1 mA | 0.085 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG | ZIG-ZAG |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 3 mm | 8.89 mm | 8.89 mm | 3 mm | 3 mm |
Maker | Intel | - | Intel | Intel | Intel |