FIFO, 256X9, 30ns, Asynchronous, CMOS, PDSO28, SOIC-28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP28,.4 |
| Contacts | 28 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 30 ns |
| Other features | RETRANSMIT |
| Maximum clock frequency (fCLK) | 33.3 MHz |
| period time | 40 ns |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e0 |
| length | 18.3642 mm |
| memory density | 2304 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 256X9 |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP28,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B |
| Maximum seat height | 3.048 mm |
| Maximum standby current | 0.015 A |
| Maximum slew rate | 0.1 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 8.763 mm |
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