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HLX6228TVN

Description
Standard SRAM, 128KX8, 30ns, CMOS, CDFP32, 0.820 X 0.600 INCH, CERAMIC, FP-32
Categorystorage    storage   
File Size165KB,12 Pages
ManufacturerHoneywell
Websitehttp://www.ssec.honeywell.com/
Download Datasheet Parametric View All

HLX6228TVN Overview

Standard SRAM, 128KX8, 30ns, CMOS, CDFP32, 0.820 X 0.600 INCH, CERAMIC, FP-32

HLX6228TVN Parametric

Parameter NameAttribute value
MakerHoneywell
Parts packaging codeDFP
package instructionDFP,
Contacts32
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time30 ns
JESD-30 codeR-CDFP-F32
length20.83 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Certification statusNot Qualified
Filter levelMIL-PRF-38535 Class V
Maximum seat height3.81 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
width15.24 mm
Military & Space Products
HLX6228
128K x 8 STATIC RAM—Low Power SOI
FEATURES
RADIATION
• Fabricated with RICMOS
IV Silicon on Insulator
(SOI) 0.7
µm
Low Power Process (L
eff
= 0.55
µm)
• Total Dose Hardness through 1x10
6
rad(SiO
2
)
• Neutron Hardness through 1x10
14
cm
-2
• Dynamic and Static Transient Upset Hardness
through 1x10
9
rad(Si)/s
• Dose Rate Survivability through 1x10
11
rad(Si)/s
• Soft Error Rate of <1x10
-10
Upsets/bit-day in Geosyn-
chronous Orbit
• No Latchup
OTHER
• Read/Write Cycle Times
30 ns (-55 to 125°C)
• Typical Operating Power <9 mW/MHz
• JEDEC Standard Low Voltage
CMOS Compatible I/O
• Single 3.3 V
±
0.3 V Power Supply
• Asynchronous Operation
• Packaging Options
– 32-Lead CFP (0.820 in. x 0.600 in.)
– 40-Lead CFP (0.775 in. x 0.710 in.)
GENERAL DESCRIPTION
The 128K x 8 Radiation Hardened Static RAM is a high
performance 131,072 word x 8-bit static random access
memory with industry-standard functionality. It is fabricated
with Honeywell’s radiation hardened technology, and is
designed for use in low voltage systems operating in radiation
environments. The RAM operates over the full military
temperature range and requires only a single 3.3 V
±
0.3V
power supply. The RAM is compatible with JEDEC standard
low voltage CMOS I/O. Power consumption is typically less
than 9 mW/MHz in operation, and less than 2 mW when de-
selected. The RAM read operation is fully asynchronous, with
an associated typical access time of 30 ns at 3.3 V.
Honeywell’s enhanced SOI RICMOS™ IV (Radiation Insensi-
tive CMOS) technology is radiation hardened through the use
of advanced and proprietary design, layout and process
hardening techniques.The RICMOS™ IV low power process is
a SIMOX CMOS technology with a 150 Å gate oxide and a
minimum drawn feature size of 0.7
µm
(0.55
µm
effective gate
length—L
eff
). Additional features include tungsten via plugs,
Honeywell’s proprietary SHARP planarization process and a
lightly doped drain (LDD) structure for improved short channel
reliability. A 7 transistor (7T) memory cell is used for superior
single event upset hardening, while three layer metal power
bussing and the low collection volume SIMOX substrate
provide improved dose rate hardening.
Solid State Electronics Center • 12001 State Highway 55, Plymouth, MN 55441 • (800) 323-8295 • http://www.ssec.honeywell.com
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