FIFO, 16KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Cypress Semiconductor |
Parts packaging code | QFJ |
package instruction | PLASTIC, LCC-32 |
Contacts | 32 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 25 ns |
Other features | RETRANSMIT |
Maximum clock frequency (fCLK) | 28.5 MHz |
period time | 35 ns |
JESD-30 code | R-PQCC-J32 |
JESD-609 code | e0 |
length | 13.97 mm |
memory density | 147456 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 16384 words |
character code | 16000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 16KX9 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.55 mm |
Maximum standby current | 0.002 A |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 11.43 mm |