Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, UCSP-9
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | BGA |
| package instruction | 1.5 X 1.5 MM, UCSP-9 |
| Contacts | 9 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Nominal bandwidth | 22 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| JESD-30 code | S-PBGA-B9 |
| length | 1.52 mm |
| Humidity sensitivity level | 1 |
| Number of channels | 1 |
| Number of functions | 1 |
| Number of terminals | 9 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output power | 1.4 W |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 245 |
| Certification status | Not Qualified |
| Maximum seat height | 0.67 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 1.52 mm |
| MAX9717AEBL | MAX9717AEUA-T | MAX9717CEUA-T | MAX9716ETA+ | MAX9717DEUA-T | MAX9717BEUA-T | MAX9717CEBL+ | MAX9717BEBL | |
|---|---|---|---|---|---|---|---|---|
| Description | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PDSO8, 3 X 3 MM, MO-187, MICRO, SOP-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PDSO8, 3 X 3 MM, MO-187, MICRO, SOP-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, TDFN-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PDSO8, 3 X 3 MM, MO-187, MICRO, SOP-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PDSO8, 3 X 3 MM, MO-187, MICRO, SOP-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, ROHS COMPLIANT, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, UCSP-9 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Lead free | Contains lead | Contains lead | Lead free | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | conform to | incompatible | incompatible | conform to | incompatible |
| Parts packaging code | BGA | TSSOP | TSSOP | DFN | TSSOP | TSSOP | BGA | BGA |
| package instruction | 1.5 X 1.5 MM, UCSP-9 | 3 X 3 MM, MO-187, MICRO, SOP-8 | HTSSOP, TSSOP8,.19 | HVSON, SOLCC8,.12,25 | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 | VFBGA, | 1.5 X 1.5 MM, UCSP-9 |
| Contacts | 9 | 8 | 8 | 8 | 8 | 8 | 9 | 9 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | compliant | not_compliant | not_compliant | compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Nominal bandwidth | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz |
| Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 code | S-PBGA-B9 | S-PDSO-G8 | S-PDSO-G8 | S-XDSO-N8 | S-PDSO-G8 | S-PDSO-G8 | S-PBGA-B9 | S-PBGA-B9 |
| length | 1.52 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 1.52 mm | 1.52 mm |
| Number of channels | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 9 | 8 | 8 | 8 | 8 | 8 | 9 | 9 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Nominal output power | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | VFBGA | HTSSOP | HTSSOP | HVSON | HTSSOP | HTSSOP | VFBGA | VFBGA |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 245 | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 245 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 0.67 mm | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm | 1.1 mm | 0.67 mm | 0.67 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | BALL | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | BALL | BALL |
| Terminal pitch | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm |
| Terminal location | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 1.52 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 1.52 mm | 1.52 mm |
| Maker | Maxim | Maxim | - | - | Maxim | Maxim | Maxim | Maxim |
| JESD-609 code | - | e0 | e0 | e3 | e0 | e0 | e1 | - |
| Encapsulate equivalent code | - | TSSOP8,.19 | TSSOP8,.19 | SOLCC8,.12,25 | TSSOP8,.19 | TSSOP8,.19 | - | - |
| power supply | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | - |
| Maximum slew rate | - | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | - | - |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | - |
| Gain | - | - | 9 dB | - | 12 dB | 6 dB | 9 dB | 6 dB |
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