|
MAX98310EWL+ |
MAX98309EWL+ |
Description |
Audio Amplifier, 2.7W, 1 Channel(s), 1 Func, PBGA9, 1 X 1 MM, 0.30 MM PITCH, ROHS COMPLIANT, WLP-9 |
Audio Amplifier, 2.7W, 1 Channel(s), 1 Func, PBGA9, 1 X 1 MM, 0.30 MM PITCH, ROHS COMPLIANT, WLP-9 |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Maxim |
Maxim |
Parts packaging code |
BGA |
BGA |
package instruction |
VFBGA, BGA9,3X3,12 |
VFBGA, BGA9,3X3,12 |
Contacts |
9 |
9 |
Reach Compliance Code |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
Factory Lead Time |
12 weeks |
12 weeks |
Nominal bandwidth |
22 kHz |
22 kHz |
Commercial integrated circuit types |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
JESD-30 code |
S-PBGA-B9 |
S-PBGA-B9 |
length |
0.965 mm |
0.965 mm |
Humidity sensitivity level |
1 |
1 |
Number of channels |
1 |
1 |
Number of functions |
1 |
1 |
Number of terminals |
9 |
9 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Nominal output power |
2.7 W |
2.7 W |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
VFBGA |
VFBGA |
Encapsulate equivalent code |
BGA9,3X3,12 |
BGA9,3X3,12 |
Package shape |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3.7 V |
3.7 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
0.69 mm |
0.69 mm |
Maximum slew rate |
1.8 mA |
1.8 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
BALL |
Terminal pitch |
0.3 mm |
0.3 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
0.965 mm |
0.965 mm |