DDR DRAM Module, 1GX72, 20ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | SAMSUNG |
| Parts packaging code | DIMM |
| package instruction | DIMM, DIMM240,40 |
| Contacts | 240 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| access mode | DUAL BANK PAGE BURST |
| Maximum access time | 20 ns |
| Other features | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 800 MHz |
| I/O type | COMMON |
| JESD-30 code | R-XDMA-N240 |
| length | 133.35 mm |
| memory density | 77309411328 bit |
| Memory IC Type | DDR DRAM MODULE |
| memory width | 72 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 240 |
| word count | 1073741824 words |
| character code | 1000000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| organize | 1GX72 |
| Output characteristics | 3-STATE |
| Package body material | UNSPECIFIED |
| encapsulated code | DIMM |
| Encapsulate equivalent code | DIMM240,40 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 1.5 V |
| Certification status | Not Qualified |
| refresh cycle | 8192 |
| Maximum seat height | 18.9 mm |
| self refresh | YES |
| Maximum standby current | 1.062 A |
| Maximum slew rate | 3.42 mA |
| Maximum supply voltage (Vsup) | 1.575 V |
| Minimum supply voltage (Vsup) | 1.425 V |
| Nominal supply voltage (Vsup) | 1.5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | NO LEAD |
| Terminal pitch | 1 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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