CYStech Electronics Corp.
3.0Amp. Glass Passivated Super Fast Rectifiers
Spec. No. : C193LD
Issued Date : 2012.12.11
Revised Date :
Page No. : 1/3
SF31G thru SF38G
Features
•
High current capability
•
High reliability
•
Low forward voltage drop
•
High surge current capability
Mechanical Data
•
Case: Molded plastic DO-201AD
•
Terminals: Solder plated, solderable per MIL-STD-750 method 2026
•
Polarity: Indicated by cathode band.
•
Epoxy : UL94V-0 rate flame retardant
•
Weight: 0.041 oz., 1.15 gram
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous
forward voltage, I
F
=3A
(Note 1)
Reverse Recovery Time
Average forward rectified current
@T
A
=95
℃
Peak forward surge current @8.3ms
single half sine wave superimposed
on rated load (JEDEC method)
Maximum DC reverse current
V
R
=V
RRM
,T
A
=25
℃
(Note 1)
V
R
=V
RRM
,T
A
=100
℃
(Note 1)
Storage temperature
Operating temperature
Symbol
V
RRM
V
RMS
V
R
V
F
trr
I
FAV
I
FSM
SF
31G
50
35
50
SF
32G
100
70
100
SF
33G
150
105
150
Type
SF
SF
34G 35G
200
300
140
210
200
300
1.3
35
3
125
SF
36G
400
280
400
SF
37G
500
350
500
1.7
SF Units
38G
600
V
420
V
600
V
V
ns
A
A
0.95
I
R
Tstg
T
J
5
100
-55 ~ +150
-55 ~ +150
μA
μA
℃
℃
Notes : 1. Pulse test, pulse width=300μsec, 2% duty cycle
2 .
Reverse recovery test condition: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
SF31G thru SF38G
CYStek Product Specification
CYStech Electronics Corp.
DO-201AD Dimension
Spec. No. : C193LD
Issued Date : 2012.12.11
Revised Date :
Page No. : 3/3
DO-201AD Molded Plastic Package
CYStek Package Code: LD
DIM
A
B
C
Inches
Min.
Max.
ϕ0.048 ϕ0.052
1.000
-
0.285
0.375
Millimeters
Min.
Max.
ϕ1.20
ϕ1.30
25.40
-
7.20
9.50
DIM
D
E
Inches
Min.
Max.
1.000
-
ϕ0.197 ϕ0.220
Millimeters
Min.
Max.
25.40
-
ϕ5.00
ϕ5.60
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
•
Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SF31G thru SF38G
CYStek Product Specification
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