CYStech Electronics Corp.
3.0Amp Schottky Barrier Rectifiers
Reverse Voltage 20V to 60V
Forward Current 3A
Spec. No. : C761LD
Issued Date : 2009.05.14
Revised Date :
Page No. : 1/3
SB320 thru SB360
Features
•
Metal-semiconductor junction with guard ring.
•
Epitaxial construction
•
Low forward voltage drop
•
High current capability
Outline
DO-201AD
Mechanical Data
•
Case : Molded plastic DO-201AD
•
Epoxy : UL94V-0 rate flame retardant
•
Terminals: Solderable per MIL-STD-202 method 208 guaranteed
•
Polarity: Color band denotes cathode end.
•
Mounting Position : Any.
•
Weight: 0.041 oz., 1.15 gram
Maximum Ratings and Electrical Characteristics
(Rating
at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%)
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum forward voltage at I
F
=3A
Maximum average forward rectified current @
0.375”(9.5mm) lead length
(see Fig 1)
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load (JEDEC
method)
T
J
=25°C
Maximum DC reverse current at
rated DC blocking voltage
T
J
=100°C
Typical thermal resistance, junction to lead
Typical junction capacitance @ f=1MHz and
applied 4VDC reverse voltage
Operating junction temperature range
Storage temperature range
Symbol
V
RRM
V
RMS
V
DC
V
F
I
F(AV)
I
FSM
I
R
R
θJL
C
J
T
J
T
STG
Type
Units
SB320 SB330 SB340 SB350 SB360
20
30
40
50
60
V
14
21
28
35
42
V
20
30
40
50
60
V
0.50
0.74
V
3
100
0.5
20
15
250
-55 ~ +125
-55 ~ +150
A
A
mA
℃
/W
pF
℃
℃
SB320 thru SB360
CYStek Product Specification
CYStech Electronics Corp.
DO-201AD Dimension
Spec. No. : C761LD
Issued Date : 2009.05.14
Revised Date :
Page No. : 3/3
DO-201AD Molded Plastic Package
CYStek Package Code: LD
DIM
A
B
C
Inches
Min.
Max.
ϕ0.048 ϕ0.052
1.000
-
0.285
0.375
Millimeters
Min.
Max.
ϕ1.20
ϕ1.30
25.40
-
7.20
9.50
DIM
D
E
Inches
Min.
Max.
1.000
-
ϕ0.190 ϕ0.210
Millimeters
Min.
Max.
25.40
-
ϕ4.80
ϕ5.30
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
•
Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SB320 thru SB360
CYStek Product Specification
DSP and ARM Processors
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