|
M24256-DRDW6TP/K |
M24256-DRDW6TG/K |
M24256-DRDW6G/K |
M24256-DRDW6P/K |
M24256-DRMN6G/K |
M24256-DRMN6P/K |
M24256-DRMN6TG/K |
M24256-DRMN6TP/K |
Description |
32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8 |
32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8 |
32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8 |
32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, TSSOP-8 |
32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 |
32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 |
32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 |
32KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
Parts packaging code |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
package instruction |
ROHS COMPLIANT, TSSOP-8 |
ROHS COMPLIANT, TSSOP-8 |
ROHS COMPLIANT, TSSOP-8 |
ROHS COMPLIANT, TSSOP-8 |
0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 |
0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 |
0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 |
0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 |
Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Spare memory width |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Maximum clock frequency (fCLK) |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
Data retention time - minimum |
40 |
40 |
40 |
40 |
40 |
40 |
40 |
40 |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
I2C control byte |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
length |
4.4 mm |
4.4 mm |
4.4 mm |
4.4 mm |
4.9 mm |
4.9 mm |
4.9 mm |
4.9 mm |
memory density |
262144 bit |
262144 bit |
262144 bit |
262144 bit |
262144 bit |
262144 bit |
262144 bit |
262144 bit |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
word count |
32768 words |
32768 words |
32768 words |
32768 words |
32768 words |
32768 words |
32768 words |
32768 words |
character code |
32000 |
32000 |
32000 |
32000 |
32000 |
32000 |
32000 |
32000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
SOP |
SOP |
SOP |
SOP |
Encapsulate equivalent code |
TSSOP8,.25 |
TSSOP8,.25 |
TSSOP8,.25 |
TSSOP8,.25 |
SOP8,.25 |
SOP8,.25 |
SOP8,.25 |
SOP8,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
1.75 mm |
1.75 mm |
1.75 mm |
1.75 mm |
Serial bus type |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
Maximum standby current |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
Maximum slew rate |
0.005 mA |
0.005 mA |
0.005 mA |
0.005 mA |
0.005 mA |
0.005 mA |
0.005 mA |
0.005 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
3 mm |
3 mm |
3 mm |
3 mm |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |
Maximum write cycle time (tWC) |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
write protect |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |