Serial I/O Controller, 2 Channel(s), 0.256MBps, CMOS, CDIP40, CERAMIC, DIP-40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | compliant |
| Address bus width | |
| boundary scan | NO |
| Bus compatibility | 8080; Z80; 6800; 68000; 80188; 80186; 80286; MULTIBUS |
| maximum clock frequency | 8.192 MHz |
| letter of agreement | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC; ADCCP |
| Data encoding/decoding methods | NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
| Maximum data transfer rate | 0.256 MBps |
| External data bus width | 8 |
| JESD-30 code | R-CDIP-T40 |
| JESD-609 code | e0 |
| length | 52.2605 mm |
| low power mode | NO |
| Number of DMA channels | |
| Number of I/O lines | |
| Number of serial I/Os | 2 |
| Number of terminals | 40 |
| On-chip data RAM width | |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (number of words) | 0 |
| Maximum seat height | 5.588 mm |
| Maximum slew rate | 18 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
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